Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures
This paper discusses how the microstructures of Sn films affect the kinetics of spontaneous Sn whisker growth. Thin films and those with small grains grew longer whiskers at higher rates than did thick films and those with large grains. Biaxial stresses in the films were measured using synchrotron r...
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| Veröffentlicht in: | Journal of materials science 2016-04, Vol.51 (7), p.3600-3606 |
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| container_end_page | 3606 |
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| container_title | Journal of materials science |
| container_volume | 51 |
| creator | Chen, Hao Lee, Hsin Yi Ku, Ching Shun Wu, Albert T |
| description | This paper discusses how the microstructures of Sn films affect the kinetics of spontaneous Sn whisker growth. Thin films and those with small grains grew longer whiskers at higher rates than did thick films and those with large grains. Biaxial stresses in the films were measured using synchrotron radiation X-ray; the stress evolution during annealing was correlated with the growth kinetics. An incubation period was observed, in which the compressive stresses in the films built up and the whiskers nucleated. The results indicate that thickness has a greater effect on whisker growth than grain size has. |
| doi_str_mv | 10.1007/s10853-015-9680-y |
| format | Article |
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Thin films and those with small grains grew longer whiskers at higher rates than did thick films and those with large grains. Biaxial stresses in the films were measured using synchrotron radiation X-ray; the stress evolution during annealing was correlated with the growth kinetics. An incubation period was observed, in which the compressive stresses in the films built up and the whiskers nucleated. The results indicate that thickness has a greater effect on whisker growth than grain size has.</description><identifier>ISSN: 0022-2461</identifier><identifier>EISSN: 1573-4803</identifier><identifier>DOI: 10.1007/s10853-015-9680-y</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Analysis ; Annealing ; Axial stress ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Classical Mechanics ; Compressive properties ; Crystallography and Scattering Methods ; Evolution ; Grain size ; Grains ; Intermetallic compounds ; Materials Science ; Microstructure ; Original Paper ; Particle accelerators ; Polymer Sciences ; Qualitative analysis ; Residual stress ; small cereal grains ; Solid Mechanics ; Stresses ; Synchrotron radiation ; Thick films ; Thin films ; tin ; X-radiation</subject><ispartof>Journal of materials science, 2016-04, Vol.51 (7), p.3600-3606</ispartof><rights>Springer Science+Business Media New York 2015</rights><rights>COPYRIGHT 2016 Springer</rights><rights>Journal of Materials Science is a copyright of Springer, (2015). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c516t-d70caafe72a1ca6f41c14de45d31035449e8ee2b766a6155f72621b88a715a3c3</citedby><cites>FETCH-LOGICAL-c516t-d70caafe72a1ca6f41c14de45d31035449e8ee2b766a6155f72621b88a715a3c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10853-015-9680-y$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10853-015-9680-y$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27903,27904,41467,42536,51297</link.rule.ids></links><search><creatorcontrib>Chen, Hao</creatorcontrib><creatorcontrib>Lee, Hsin Yi</creatorcontrib><creatorcontrib>Ku, Ching Shun</creatorcontrib><creatorcontrib>Wu, Albert T</creatorcontrib><title>Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures</title><title>Journal of materials science</title><addtitle>J Mater Sci</addtitle><description>This paper discusses how the microstructures of Sn films affect the kinetics of spontaneous Sn whisker growth. Thin films and those with small grains grew longer whiskers at higher rates than did thick films and those with large grains. Biaxial stresses in the films were measured using synchrotron radiation X-ray; the stress evolution during annealing was correlated with the growth kinetics. An incubation period was observed, in which the compressive stresses in the films built up and the whiskers nucleated. The results indicate that thickness has a greater effect on whisker growth than grain size has.</description><subject>Analysis</subject><subject>Annealing</subject><subject>Axial stress</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Classical Mechanics</subject><subject>Compressive properties</subject><subject>Crystallography and Scattering Methods</subject><subject>Evolution</subject><subject>Grain size</subject><subject>Grains</subject><subject>Intermetallic compounds</subject><subject>Materials Science</subject><subject>Microstructure</subject><subject>Original Paper</subject><subject>Particle accelerators</subject><subject>Polymer Sciences</subject><subject>Qualitative analysis</subject><subject>Residual stress</subject><subject>small cereal grains</subject><subject>Solid Mechanics</subject><subject>Stresses</subject><subject>Synchrotron radiation</subject><subject>Thick films</subject><subject>Thin films</subject><subject>tin</subject><subject>X-radiation</subject><issn>0022-2461</issn><issn>1573-4803</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9kk1v1DAQhiMEEkvhB3DCEhc4pHgcfyTHqipQqRISS8_W1HG2Ltm49Thb9t_jKEioHJAP9ljPO5qZd6rqLfBT4Nx8IuCtamoOqu50y-vjs2oDyjS1bHnzvNpwLkQtpIaX1SuiO865MgI2FV4c4jjnECcWB5Y8hX7GkVEuT2I49eyhxCFjDgdfYhyPFGhhtxN7vA300ydijyHfsgOmEGdi--BSLAlml-eS5XX1YsCR_Js_90l1_fnix_nX-urbl8vzs6vaKdC57g13iIM3AsGhHiQ4kL2Xqm-AN0rKzrfeixujNWpQajBCC7hpWzSgsHHNSfVhzXuf4sPsKdt9IOfHESdfyrLQaqlUxztR0Pf_oHdxTqU3skKoTnMpzEKdrtQOR2_DNMSc0JXT-9JinPwQyv-ZlKLtGtCyCD4-ERQm-195hzORvdx-f8rCyi6zouQHe5_CHtPRAreLo3Z11BZH7eKoPRaNWDVU2Gnn09-y_yd6t4oGjBZ3KZC93goOuqyAFMuK_AZboq0X</recordid><startdate>20160401</startdate><enddate>20160401</enddate><creator>Chen, Hao</creator><creator>Lee, Hsin Yi</creator><creator>Ku, Ching Shun</creator><creator>Wu, Albert T</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>FBQ</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>ISR</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M7S</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20160401</creationdate><title>Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures</title><author>Chen, Hao ; Lee, Hsin Yi ; Ku, Ching Shun ; Wu, Albert T</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c516t-d70caafe72a1ca6f41c14de45d31035449e8ee2b766a6155f72621b88a715a3c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Analysis</topic><topic>Annealing</topic><topic>Axial stress</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Classical Mechanics</topic><topic>Compressive properties</topic><topic>Crystallography and Scattering Methods</topic><topic>Evolution</topic><topic>Grain size</topic><topic>Grains</topic><topic>Intermetallic compounds</topic><topic>Materials Science</topic><topic>Microstructure</topic><topic>Original Paper</topic><topic>Particle accelerators</topic><topic>Polymer Sciences</topic><topic>Qualitative analysis</topic><topic>Residual stress</topic><topic>small cereal grains</topic><topic>Solid Mechanics</topic><topic>Stresses</topic><topic>Synchrotron radiation</topic><topic>Thick films</topic><topic>Thin films</topic><topic>tin</topic><topic>X-radiation</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Hao</creatorcontrib><creatorcontrib>Lee, Hsin Yi</creatorcontrib><creatorcontrib>Ku, Ching Shun</creatorcontrib><creatorcontrib>Wu, Albert T</creatorcontrib><collection>AGRIS</collection><collection>CrossRef</collection><collection>Gale In Context: Science</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chen, Hao</au><au>Lee, Hsin Yi</au><au>Ku, Ching Shun</au><au>Wu, Albert T</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures</atitle><jtitle>Journal of materials science</jtitle><stitle>J Mater Sci</stitle><date>2016-04-01</date><risdate>2016</risdate><volume>51</volume><issue>7</issue><spage>3600</spage><epage>3606</epage><pages>3600-3606</pages><issn>0022-2461</issn><eissn>1573-4803</eissn><abstract>This paper discusses how the microstructures of Sn films affect the kinetics of spontaneous Sn whisker growth. Thin films and those with small grains grew longer whiskers at higher rates than did thick films and those with large grains. Biaxial stresses in the films were measured using synchrotron radiation X-ray; the stress evolution during annealing was correlated with the growth kinetics. An incubation period was observed, in which the compressive stresses in the films built up and the whiskers nucleated. The results indicate that thickness has a greater effect on whisker growth than grain size has.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10853-015-9680-y</doi><tpages>7</tpages></addata></record> |
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| subjects | Analysis Annealing Axial stress Characterization and Evaluation of Materials Chemistry and Materials Science Classical Mechanics Compressive properties Crystallography and Scattering Methods Evolution Grain size Grains Intermetallic compounds Materials Science Microstructure Original Paper Particle accelerators Polymer Sciences Qualitative analysis Residual stress small cereal grains Solid Mechanics Stresses Synchrotron radiation Thick films Thin films tin X-radiation |
| title | Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures |
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