Die-attaching silver paste based on a novel solvent for high-power semiconductor devices
A new solvent composed of 4-(tert-butyl) cyclohexyl acetate as a dilute agent and HPMDA as a thickener was developed to make micron-sized Ag paste and to bond power semiconductors. The new Ag paste achieved sentinel printing to form sharp Ag patterns with uniform thickness and defined boundaries, wh...
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| Veröffentlicht in: | Journal of materials science 2016-04, Vol.51 (7), p.3422-3430 |
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| container_title | Journal of materials science |
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| creator | Jiu, Jinting Zhang, Hao Nagao, Shijo Sugahara, Tohru Kagami, Noriko Suzuki, Youji Akai, Yasuyuki Suganuma, Katsuaki |
| description | A new solvent composed of 4-(tert-butyl) cyclohexyl acetate as a dilute agent and HPMDA as a thickener was developed to make micron-sized Ag paste and to bond power semiconductors. The new Ag paste achieved sentinel printing to form sharp Ag patterns with uniform thickness and defined boundaries, which is a key to printing fine pitches in the electronics industry. The electrical resistivity of Ag patterns of 3 μΩ cm was obtained at 280 °C for 30 min. Two Ag-plating copper substrates were successfully bonded with the new Ag paste and the shear strength gradually increased with the bonding temperature. A high strength of 80 MPa was achieved at 280 °C under a small sintering pressure of 0.4 MPa. This value is far higher than the value obtained by using an expensive Ag nanoparticle paste. The detailed mechanism is discussed in this work by comparison with common ethylene glycol solvent. |
| doi_str_mv | 10.1007/s10853-015-9659-8 |
| format | Article |
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The new Ag paste achieved sentinel printing to form sharp Ag patterns with uniform thickness and defined boundaries, which is a key to printing fine pitches in the electronics industry. The electrical resistivity of Ag patterns of 3 μΩ cm was obtained at 280 °C for 30 min. Two Ag-plating copper substrates were successfully bonded with the new Ag paste and the shear strength gradually increased with the bonding temperature. A high strength of 80 MPa was achieved at 280 °C under a small sintering pressure of 0.4 MPa. This value is far higher than the value obtained by using an expensive Ag nanoparticle paste. The detailed mechanism is discussed in this work by comparison with common ethylene glycol solvent.</description><identifier>ISSN: 0022-2461</identifier><identifier>EISSN: 1573-4803</identifier><identifier>DOI: 10.1007/s10853-015-9659-8</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Acetates ; Bonding agents ; Bonding strength ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Classical Mechanics ; Copper plating ; Crystallography and Scattering Methods ; Ethylene glycol ; Materials Science ; Nanoparticles ; Original Paper ; Pastes ; Polymer Sciences ; Power semiconductor devices ; Printing ; Semiconductors ; Shear strength ; Silver ; Solid Mechanics ; Solvents ; Substrates ; Thickening agents</subject><ispartof>Journal of materials science, 2016-04, Vol.51 (7), p.3422-3430</ispartof><rights>Springer Science+Business Media New York 2015</rights><rights>COPYRIGHT 2016 Springer</rights><rights>Journal of Materials Science is a copyright of Springer, (2015). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c488t-40d49415a4a7781fdfdf2c54cbf3063ffdb3dbc3cf7235531107172fa918ce033</citedby><cites>FETCH-LOGICAL-c488t-40d49415a4a7781fdfdf2c54cbf3063ffdb3dbc3cf7235531107172fa918ce033</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10853-015-9659-8$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10853-015-9659-8$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Jiu, Jinting</creatorcontrib><creatorcontrib>Zhang, Hao</creatorcontrib><creatorcontrib>Nagao, Shijo</creatorcontrib><creatorcontrib>Sugahara, Tohru</creatorcontrib><creatorcontrib>Kagami, Noriko</creatorcontrib><creatorcontrib>Suzuki, Youji</creatorcontrib><creatorcontrib>Akai, Yasuyuki</creatorcontrib><creatorcontrib>Suganuma, Katsuaki</creatorcontrib><title>Die-attaching silver paste based on a novel solvent for high-power semiconductor devices</title><title>Journal of materials science</title><addtitle>J Mater Sci</addtitle><description>A new solvent composed of 4-(tert-butyl) cyclohexyl acetate as a dilute agent and HPMDA as a thickener was developed to make micron-sized Ag paste and to bond power semiconductors. The new Ag paste achieved sentinel printing to form sharp Ag patterns with uniform thickness and defined boundaries, which is a key to printing fine pitches in the electronics industry. The electrical resistivity of Ag patterns of 3 μΩ cm was obtained at 280 °C for 30 min. Two Ag-plating copper substrates were successfully bonded with the new Ag paste and the shear strength gradually increased with the bonding temperature. A high strength of 80 MPa was achieved at 280 °C under a small sintering pressure of 0.4 MPa. This value is far higher than the value obtained by using an expensive Ag nanoparticle paste. The detailed mechanism is discussed in this work by comparison with common ethylene glycol solvent.</description><subject>Acetates</subject><subject>Bonding agents</subject><subject>Bonding strength</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Classical Mechanics</subject><subject>Copper plating</subject><subject>Crystallography and Scattering Methods</subject><subject>Ethylene glycol</subject><subject>Materials Science</subject><subject>Nanoparticles</subject><subject>Original Paper</subject><subject>Pastes</subject><subject>Polymer Sciences</subject><subject>Power semiconductor devices</subject><subject>Printing</subject><subject>Semiconductors</subject><subject>Shear strength</subject><subject>Silver</subject><subject>Solid Mechanics</subject><subject>Solvents</subject><subject>Substrates</subject><subject>Thickening agents</subject><issn>0022-2461</issn><issn>1573-4803</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp1kV1rFTEQhhdR8Nj6A7wLeKMXqZl8bLKXpVYtFISq4F3IySZ7UvYkxyR7tP_e1BWkQpmLwMzzDBPernsF5AwIke8KECUYJiDw0IsBqyfdBoRkmCvCnnYbQijFlPfwvHtRyi0hREgKm-77--CwqdXYXYgTKmE-uowOplSHtqa4EaWIDIrp6GZUUpvGinzKaBemHT6kn40ubh9siuNiaxuM7hisK6fdM2_m4l7-fU-6bx8uv158wtefP15dnF9jy5WqmJORDxyE4UZKBX5sRa3gdusZ6Zn345aNW8usl5QJwQCIBEm9GUBZRxg76d6sew85_VhcqXofinXzbKJLS9Ggei6EIAQa-vo_9DYtObbrNKViEEryP9TZSk1mdjpEn2o2ttW4ftP50PrnnFM1MOiHJrx9IDSmul91Mksp-urLzUMWVtbmVEp2Xh9y2Jt8p4Ho-yD1GqRuQer7ILVqDl2d0tg4ufzv7Mel39wHnwY</recordid><startdate>20160401</startdate><enddate>20160401</enddate><creator>Jiu, Jinting</creator><creator>Zhang, Hao</creator><creator>Nagao, Shijo</creator><creator>Sugahara, Tohru</creator><creator>Kagami, Noriko</creator><creator>Suzuki, Youji</creator><creator>Akai, Yasuyuki</creator><creator>Suganuma, Katsuaki</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>ISR</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M7S</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20160401</creationdate><title>Die-attaching silver paste based on a novel solvent for high-power semiconductor devices</title><author>Jiu, Jinting ; 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The new Ag paste achieved sentinel printing to form sharp Ag patterns with uniform thickness and defined boundaries, which is a key to printing fine pitches in the electronics industry. The electrical resistivity of Ag patterns of 3 μΩ cm was obtained at 280 °C for 30 min. Two Ag-plating copper substrates were successfully bonded with the new Ag paste and the shear strength gradually increased with the bonding temperature. A high strength of 80 MPa was achieved at 280 °C under a small sintering pressure of 0.4 MPa. This value is far higher than the value obtained by using an expensive Ag nanoparticle paste. The detailed mechanism is discussed in this work by comparison with common ethylene glycol solvent.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10853-015-9659-8</doi><tpages>9</tpages></addata></record> |
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| subjects | Acetates Bonding agents Bonding strength Characterization and Evaluation of Materials Chemistry and Materials Science Classical Mechanics Copper plating Crystallography and Scattering Methods Ethylene glycol Materials Science Nanoparticles Original Paper Pastes Polymer Sciences Power semiconductor devices Printing Semiconductors Shear strength Silver Solid Mechanics Solvents Substrates Thickening agents |
| title | Die-attaching silver paste based on a novel solvent for high-power semiconductor devices |
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