Ultrafine Pitch Stencil Printing of Liquid Metal Alloys

Ultrafine Pitch Stencil Printing of Liquid Metal Alloys

With high conductivity and stretchable for large cross-sections, liquid metals such as galinstan are promising for creating stretchable devices and interconnects. Creating high resolution features in parallel is challenging, with most techniques limited to a hundred micrometers or more. In this work...

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Veröffentlicht in:ACS applied materials & interfaces 2017-01, Vol.9 (2), p.1178-1182
Hauptverfasser: Lazarus, Nathan, Bedair, Sarah S, Kierzewski, Iain M
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Bedair, Sarah S
Kierzewski, Iain M
description With high conductivity and stretchable for large cross-sections, liquid metals such as galinstan are promising for creating stretchable devices and interconnects. Creating high resolution features in parallel is challenging, with most techniques limited to a hundred micrometers or more. In this work, multilevel electroplated stencils are investigated for printing liquid metals, with galinstan features as small as ten micrometers printed on soft elastomers, a factor of 10 reduction over past liquid metal stencil printing. Capacitors and resistive strain sensors are also demonstrated, showing the potential for creating stretchable conductors and devices.
doi_str_mv 10.1021/acsami.6b13088
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title Ultrafine Pitch Stencil Printing of Liquid Metal Alloys
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