Enhancement in mechanical properties of silica low-k thin films using wet chemical technique

Silica low-k films have been deposited on silicon wafer using sol-gel spin-on method. The tetraethyl orthosilicate (TEOS) has been used as a precursor solution. In order to improve the properties, the deposited films have been surface treated by wet chemical treatment at different trimethylcholosila...

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Veröffentlicht in:	Indian journal of pure & applied physics 2016-07, Vol.54 (7), p.439-442
Hauptverfasser:	Mhaisagar, Yogesh S, Gaikwad, Anil S, Khairnar, Anil G, Mahajan, Ashok M
Format:	Artikel
Sprache:	eng
Schlagworte:	Contact angle Hardness Hexanes Mechanical properties Modulus of elasticity Precursors Silicon dioxide Thin films
Online-Zugang:	Volltext
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