Figure-of-merit for phase-change materials used in thermal management
•A FOM for PCMs in thermal management is evaluated numerically and experimentally.•Realistic boundary conditions leading to no explicit analytical solution are studied.•The FOM is important in selecting PCMs, while sensible heat is a lesser design factor.•Adding a PCM has little effect on an applica...
Gespeichert in:
| Veröffentlicht in: | International journal of heat and mass transfer 2016-10, Vol.101, p.764-771 |
|---|---|
| Hauptverfasser: | , , , , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 771 |
|---|---|
| container_issue | |
| container_start_page | 764 |
| container_title | International journal of heat and mass transfer |
| container_volume | 101 |
| creator | Shao, Lei Raghavan, Arun Kim, Gun-Ho Emurian, Laurel Rosen, Jeffrey Papaefthymiou, Marios C. Wenisch, Thomas F. Martin, Milo M.K. Pipe, Kevin P. |
| description | •A FOM for PCMs in thermal management is evaluated numerically and experimentally.•Realistic boundary conditions leading to no explicit analytical solution are studied.•The FOM is important in selecting PCMs, while sensible heat is a lesser design factor.•Adding a PCM has little effect on an application’s maximum steady-state duty cycle.•A high-FOM PCM is experimentally shown to manage heat spikes in a smartphone.
In this work, we utilize a figure-of-merit (FOM) to compare the performance of various phase-change materials (PCMs) in managing short bursts of high-power heat flux, particularly those associated with microprocessors undergoing bursty operation on a time scale of approximately one second. We numerically investigate the FOM for applications that have realistic boundary conditions and lack analytical solutions. We also fabricate microprocessor proxies with integrated PCM compartments mounted in a smartphone package, and experimentally demonstrate the use of a high-FOM PCM to buffer short heat spikes as large as 11W/cm2. |
| doi_str_mv | 10.1016/j.ijheatmasstransfer.2016.05.040 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1835649052</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0017931015313077</els_id><sourcerecordid>1835649052</sourcerecordid><originalsourceid>FETCH-LOGICAL-c433t-328137dfe8d90a9e283029909a673de279f5eac3371491caff89ec6e63af2d323</originalsourceid><addsrcrecordid>eNqNkEtLxDAURoMoOI7-hy5n05pHX9kpw4wPBtzoOlzSm2lKH2OSCv57U8adG1fhcj4O5BCyYTRjlJX3XWa7FiEM4H1wMHqDLuORZLTIaE4vyIrVlUw5q-UlWVHKqlQKRq_JjffdctK8XJHd3h5nh-lk0gGdDYmZXHJqwWOqWxiPmAwQIoDeJ7PHJrFjElp0A_SRjHDEAcdwS65MXODd77smH_vd-_Y5Pbw9vWwfD6nOhQip4DUTVWOwbiQFibwWlEtJJZSVaJBX0hQIWoiK5ZJpMKaWqEssBRjeCC7WZHP2ntz0OaMParBeY9_DiNPsFatFUeaSFsv04TzVbvLeoVEnZwdw34pRtRRUnfpbUC0FFS1ULBgVr2cFxi992Ui9tjhqbKxDHVQz2f_LfgAt2Yay</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1835649052</pqid></control><display><type>article</type><title>Figure-of-merit for phase-change materials used in thermal management</title><source>Elsevier ScienceDirect Journals</source><creator>Shao, Lei ; Raghavan, Arun ; Kim, Gun-Ho ; Emurian, Laurel ; Rosen, Jeffrey ; Papaefthymiou, Marios C. ; Wenisch, Thomas F. ; Martin, Milo M.K. ; Pipe, Kevin P.</creator><creatorcontrib>Shao, Lei ; Raghavan, Arun ; Kim, Gun-Ho ; Emurian, Laurel ; Rosen, Jeffrey ; Papaefthymiou, Marios C. ; Wenisch, Thomas F. ; Martin, Milo M.K. ; Pipe, Kevin P.</creatorcontrib><description>•A FOM for PCMs in thermal management is evaluated numerically and experimentally.•Realistic boundary conditions leading to no explicit analytical solution are studied.•The FOM is important in selecting PCMs, while sensible heat is a lesser design factor.•Adding a PCM has little effect on an application’s maximum steady-state duty cycle.•A high-FOM PCM is experimentally shown to manage heat spikes in a smartphone.
In this work, we utilize a figure-of-merit (FOM) to compare the performance of various phase-change materials (PCMs) in managing short bursts of high-power heat flux, particularly those associated with microprocessors undergoing bursty operation on a time scale of approximately one second. We numerically investigate the FOM for applications that have realistic boundary conditions and lack analytical solutions. We also fabricate microprocessor proxies with integrated PCM compartments mounted in a smartphone package, and experimentally demonstrate the use of a high-FOM PCM to buffer short heat spikes as large as 11W/cm2.</description><identifier>ISSN: 0017-9310</identifier><identifier>EISSN: 1879-2189</identifier><identifier>DOI: 10.1016/j.ijheatmasstransfer.2016.05.040</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>Buffers ; Bursting ; Compartments ; Computational sprinting ; Figure-of-merit (FOM) ; Heat sinks ; Mass transfer ; Mathematical analysis ; Metallic alloys ; Microprocessors ; Packages ; Phase-change heat sinks ; Phase-change materials (PCMs) ; Thermal management</subject><ispartof>International journal of heat and mass transfer, 2016-10, Vol.101, p.764-771</ispartof><rights>2016 Elsevier Ltd</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c433t-328137dfe8d90a9e283029909a673de279f5eac3371491caff89ec6e63af2d323</citedby><cites>FETCH-LOGICAL-c433t-328137dfe8d90a9e283029909a673de279f5eac3371491caff89ec6e63af2d323</cites><orcidid>0000-0001-7385-9033</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.ijheatmasstransfer.2016.05.040$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,777,781,3537,27905,27906,45976</link.rule.ids></links><search><creatorcontrib>Shao, Lei</creatorcontrib><creatorcontrib>Raghavan, Arun</creatorcontrib><creatorcontrib>Kim, Gun-Ho</creatorcontrib><creatorcontrib>Emurian, Laurel</creatorcontrib><creatorcontrib>Rosen, Jeffrey</creatorcontrib><creatorcontrib>Papaefthymiou, Marios C.</creatorcontrib><creatorcontrib>Wenisch, Thomas F.</creatorcontrib><creatorcontrib>Martin, Milo M.K.</creatorcontrib><creatorcontrib>Pipe, Kevin P.</creatorcontrib><title>Figure-of-merit for phase-change materials used in thermal management</title><title>International journal of heat and mass transfer</title><description>•A FOM for PCMs in thermal management is evaluated numerically and experimentally.•Realistic boundary conditions leading to no explicit analytical solution are studied.•The FOM is important in selecting PCMs, while sensible heat is a lesser design factor.•Adding a PCM has little effect on an application’s maximum steady-state duty cycle.•A high-FOM PCM is experimentally shown to manage heat spikes in a smartphone.
In this work, we utilize a figure-of-merit (FOM) to compare the performance of various phase-change materials (PCMs) in managing short bursts of high-power heat flux, particularly those associated with microprocessors undergoing bursty operation on a time scale of approximately one second. We numerically investigate the FOM for applications that have realistic boundary conditions and lack analytical solutions. We also fabricate microprocessor proxies with integrated PCM compartments mounted in a smartphone package, and experimentally demonstrate the use of a high-FOM PCM to buffer short heat spikes as large as 11W/cm2.</description><subject>Buffers</subject><subject>Bursting</subject><subject>Compartments</subject><subject>Computational sprinting</subject><subject>Figure-of-merit (FOM)</subject><subject>Heat sinks</subject><subject>Mass transfer</subject><subject>Mathematical analysis</subject><subject>Metallic alloys</subject><subject>Microprocessors</subject><subject>Packages</subject><subject>Phase-change heat sinks</subject><subject>Phase-change materials (PCMs)</subject><subject>Thermal management</subject><issn>0017-9310</issn><issn>1879-2189</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><recordid>eNqNkEtLxDAURoMoOI7-hy5n05pHX9kpw4wPBtzoOlzSm2lKH2OSCv57U8adG1fhcj4O5BCyYTRjlJX3XWa7FiEM4H1wMHqDLuORZLTIaE4vyIrVlUw5q-UlWVHKqlQKRq_JjffdctK8XJHd3h5nh-lk0gGdDYmZXHJqwWOqWxiPmAwQIoDeJ7PHJrFjElp0A_SRjHDEAcdwS65MXODd77smH_vd-_Y5Pbw9vWwfD6nOhQip4DUTVWOwbiQFibwWlEtJJZSVaJBX0hQIWoiK5ZJpMKaWqEssBRjeCC7WZHP2ntz0OaMParBeY9_DiNPsFatFUeaSFsv04TzVbvLeoVEnZwdw34pRtRRUnfpbUC0FFS1ULBgVr2cFxi992Ui9tjhqbKxDHVQz2f_LfgAt2Yay</recordid><startdate>201610</startdate><enddate>201610</enddate><creator>Shao, Lei</creator><creator>Raghavan, Arun</creator><creator>Kim, Gun-Ho</creator><creator>Emurian, Laurel</creator><creator>Rosen, Jeffrey</creator><creator>Papaefthymiou, Marios C.</creator><creator>Wenisch, Thomas F.</creator><creator>Martin, Milo M.K.</creator><creator>Pipe, Kevin P.</creator><general>Elsevier Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>H8D</scope><scope>KR7</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0001-7385-9033</orcidid></search><sort><creationdate>201610</creationdate><title>Figure-of-merit for phase-change materials used in thermal management</title><author>Shao, Lei ; Raghavan, Arun ; Kim, Gun-Ho ; Emurian, Laurel ; Rosen, Jeffrey ; Papaefthymiou, Marios C. ; Wenisch, Thomas F. ; Martin, Milo M.K. ; Pipe, Kevin P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c433t-328137dfe8d90a9e283029909a673de279f5eac3371491caff89ec6e63af2d323</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Buffers</topic><topic>Bursting</topic><topic>Compartments</topic><topic>Computational sprinting</topic><topic>Figure-of-merit (FOM)</topic><topic>Heat sinks</topic><topic>Mass transfer</topic><topic>Mathematical analysis</topic><topic>Metallic alloys</topic><topic>Microprocessors</topic><topic>Packages</topic><topic>Phase-change heat sinks</topic><topic>Phase-change materials (PCMs)</topic><topic>Thermal management</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Shao, Lei</creatorcontrib><creatorcontrib>Raghavan, Arun</creatorcontrib><creatorcontrib>Kim, Gun-Ho</creatorcontrib><creatorcontrib>Emurian, Laurel</creatorcontrib><creatorcontrib>Rosen, Jeffrey</creatorcontrib><creatorcontrib>Papaefthymiou, Marios C.</creatorcontrib><creatorcontrib>Wenisch, Thomas F.</creatorcontrib><creatorcontrib>Martin, Milo M.K.</creatorcontrib><creatorcontrib>Pipe, Kevin P.</creatorcontrib><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>International journal of heat and mass transfer</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Shao, Lei</au><au>Raghavan, Arun</au><au>Kim, Gun-Ho</au><au>Emurian, Laurel</au><au>Rosen, Jeffrey</au><au>Papaefthymiou, Marios C.</au><au>Wenisch, Thomas F.</au><au>Martin, Milo M.K.</au><au>Pipe, Kevin P.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Figure-of-merit for phase-change materials used in thermal management</atitle><jtitle>International journal of heat and mass transfer</jtitle><date>2016-10</date><risdate>2016</risdate><volume>101</volume><spage>764</spage><epage>771</epage><pages>764-771</pages><issn>0017-9310</issn><eissn>1879-2189</eissn><abstract>•A FOM for PCMs in thermal management is evaluated numerically and experimentally.•Realistic boundary conditions leading to no explicit analytical solution are studied.•The FOM is important in selecting PCMs, while sensible heat is a lesser design factor.•Adding a PCM has little effect on an application’s maximum steady-state duty cycle.•A high-FOM PCM is experimentally shown to manage heat spikes in a smartphone.
In this work, we utilize a figure-of-merit (FOM) to compare the performance of various phase-change materials (PCMs) in managing short bursts of high-power heat flux, particularly those associated with microprocessors undergoing bursty operation on a time scale of approximately one second. We numerically investigate the FOM for applications that have realistic boundary conditions and lack analytical solutions. We also fabricate microprocessor proxies with integrated PCM compartments mounted in a smartphone package, and experimentally demonstrate the use of a high-FOM PCM to buffer short heat spikes as large as 11W/cm2.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/j.ijheatmasstransfer.2016.05.040</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0001-7385-9033</orcidid><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0017-9310 |
| ispartof | International journal of heat and mass transfer, 2016-10, Vol.101, p.764-771 |
| issn | 0017-9310 1879-2189 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_1835649052 |
| source | Elsevier ScienceDirect Journals |
| subjects | Buffers Bursting Compartments Computational sprinting Figure-of-merit (FOM) Heat sinks Mass transfer Mathematical analysis Metallic alloys Microprocessors Packages Phase-change heat sinks Phase-change materials (PCMs) Thermal management |
| title | Figure-of-merit for phase-change materials used in thermal management |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T23%3A16%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Figure-of-merit%20for%20phase-change%20materials%20used%20in%20thermal%20management&rft.jtitle=International%20journal%20of%20heat%20and%20mass%20transfer&rft.au=Shao,%20Lei&rft.date=2016-10&rft.volume=101&rft.spage=764&rft.epage=771&rft.pages=764-771&rft.issn=0017-9310&rft.eissn=1879-2189&rft_id=info:doi/10.1016/j.ijheatmasstransfer.2016.05.040&rft_dat=%3Cproquest_cross%3E1835649052%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1835649052&rft_id=info:pmid/&rft_els_id=S0017931015313077&rfr_iscdi=true |