Overlay-Aware Detailed Routing for Self-Aligned Double Patterning Lithography Using the Cut Process
Self-aligned double patterning (SADP) is one of the most promising techniques for sub-20 nm technology. Spacer-is-dielectric SADP using a cut process is getting popular because of its higher design flexibility; for example, it can decompose odd cycles without the need of inserting any stitch. This p...
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Veröffentlicht in: | IEEE transactions on computer-aided design of integrated circuits and systems 2016-09, Vol.35 (9), p.1519-1531 |
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