Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip

A 3D stacked network-on-chip (NOC) promises the integration of a large number of cores in a many-core system-on-chip (SOC). The NOC can be used to test the embedded cores in such SOCs, whereby the added cost of dedicated test-access hardware can be avoided. However, a potential problem associated wi...

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