A thermal cycling reliability study of ultrasonically bonded copper wires

In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial...

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Veröffentlicht in:	Microelectronics and reliability 2016-04, Vol.59, p.126-133
Hauptverfasser:	Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.
Format:	Artikel
Sprache:	eng
Schlagworte:	BONDING BONDS Copper HARDNESS Heavy copper wire bonding Initial conditions Passive thermal cycling Power electronics Reliability Shear Shear strength Thermal cycling Three dimensional ULTRASONICS WIRE
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