A thermal cycling reliability study of ultrasonically bonded copper wires
In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial...
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| Veröffentlicht in: | Microelectronics and reliability 2016-04, Vol.59, p.126-133 |
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| container_title | Microelectronics and reliability |
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| creator | Arjmand, Elaheh Agyakwa, Pearl A. Corfield, Martin R. Li, Jianfeng Mouawad, Bassem Mark Johnson, C. |
| description | In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial conditions to 2900 passive thermal cycles from −55 to 125°C. Instead, an apparent increase in shear strength is observed as the number of thermal cycles increases. Nanoindentation hardness investigations suggest the occurrence of cyclic hardening. Microstructural investigations of the interfacial morphologies before and after cycling and after shear testing are also presented and discussed.
•A thermal cycling reliability study of ultrasonically bonded copper wires on Cu substrates is reported.•Results showed no discernible degradation or wear out from initial condition to 2900 passive thermal cycles from −55 to 125°C.•Results obtained from nanoindentation showed cyclic hardening that might explain the increase in shear force after cycling. |
| doi_str_mv | 10.1016/j.microrel.2016.01.009 |
| format | Article |
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•A thermal cycling reliability study of ultrasonically bonded copper wires on Cu substrates is reported.•Results showed no discernible degradation or wear out from initial condition to 2900 passive thermal cycles from −55 to 125°C.•Results obtained from nanoindentation showed cyclic hardening that might explain the increase in shear force after cycling.</description><identifier>ISSN: 0026-2714</identifier><identifier>EISSN: 1872-941X</identifier><identifier>DOI: 10.1016/j.microrel.2016.01.009</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>BONDING ; BONDS ; Copper ; HARDNESS ; Heavy copper wire bonding ; Initial conditions ; Passive thermal cycling ; Power electronics ; Reliability ; Shear ; Shear strength ; Thermal cycling ; Three dimensional ; ULTRASONICS ; WIRE</subject><ispartof>Microelectronics and reliability, 2016-04, Vol.59, p.126-133</ispartof><rights>2016 The Authors</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c393t-f2c50b4f754161b2bbe0abb8a615c6e685d578451339d234d7217b2058cf5bbd3</citedby><cites>FETCH-LOGICAL-c393t-f2c50b4f754161b2bbe0abb8a615c6e685d578451339d234d7217b2058cf5bbd3</cites><orcidid>0000-0001-5019-8818</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.microrel.2016.01.009$$EHTML$$P50$$Gelsevier$$Hfree_for_read</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids></links><search><creatorcontrib>Arjmand, Elaheh</creatorcontrib><creatorcontrib>Agyakwa, Pearl A.</creatorcontrib><creatorcontrib>Corfield, Martin R.</creatorcontrib><creatorcontrib>Li, Jianfeng</creatorcontrib><creatorcontrib>Mouawad, Bassem</creatorcontrib><creatorcontrib>Mark Johnson, C.</creatorcontrib><title>A thermal cycling reliability study of ultrasonically bonded copper wires</title><title>Microelectronics and reliability</title><description>In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial conditions to 2900 passive thermal cycles from −55 to 125°C. Instead, an apparent increase in shear strength is observed as the number of thermal cycles increases. Nanoindentation hardness investigations suggest the occurrence of cyclic hardening. Microstructural investigations of the interfacial morphologies before and after cycling and after shear testing are also presented and discussed.
•A thermal cycling reliability study of ultrasonically bonded copper wires on Cu substrates is reported.•Results showed no discernible degradation or wear out from initial condition to 2900 passive thermal cycles from −55 to 125°C.•Results obtained from nanoindentation showed cyclic hardening that might explain the increase in shear force after cycling.</description><subject>BONDING</subject><subject>BONDS</subject><subject>Copper</subject><subject>HARDNESS</subject><subject>Heavy copper wire bonding</subject><subject>Initial conditions</subject><subject>Passive thermal cycling</subject><subject>Power electronics</subject><subject>Reliability</subject><subject>Shear</subject><subject>Shear strength</subject><subject>Thermal cycling</subject><subject>Three dimensional</subject><subject>ULTRASONICS</subject><subject>WIRE</subject><issn>0026-2714</issn><issn>1872-941X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><recordid>eNqFkEtLxDAUhYMoOI7-BcnSTeu9adPHzmHwMTDgRsFdyKuaIW3HpFX67-0wunZ1uXDOB-cj5BohRcDidpe2Toc-WJ-y-U8BU4D6hCywKllS5_h2ShYArEhYifk5uYhxBwAlIC7IZkWHDxta6ametHfdO51BTirn3TDROIxmon1DRz8EGfvOaen9RFXfGWuo7vd7G-i3CzZekrNG-mivfu-SvD7cv6yfku3z42a92iY6q7MhaZjmoPKm5DkWqJhSFqRSlSyQ68IWFTe8rHKOWVYbluWmZFgqBrzSDVfKZEtyc-TuQ_852jiI1kVtvZed7ccosMICMsh5NkeLY3TWE2OwjdgH18owCQRxcCd24s-dOLgTgGJ2NxfvjkU7D_lyNoione20NfNSPQjTu_8QP80ZfA0</recordid><startdate>201604</startdate><enddate>201604</enddate><creator>Arjmand, Elaheh</creator><creator>Agyakwa, Pearl A.</creator><creator>Corfield, Martin R.</creator><creator>Li, Jianfeng</creator><creator>Mouawad, Bassem</creator><creator>Mark Johnson, C.</creator><general>Elsevier Ltd</general><scope>6I.</scope><scope>AAFTH</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0001-5019-8818</orcidid></search><sort><creationdate>201604</creationdate><title>A thermal cycling reliability study of ultrasonically bonded copper wires</title><author>Arjmand, Elaheh ; Agyakwa, Pearl A. ; Corfield, Martin R. ; Li, Jianfeng ; Mouawad, Bassem ; Mark Johnson, C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c393t-f2c50b4f754161b2bbe0abb8a615c6e685d578451339d234d7217b2058cf5bbd3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BONDING</topic><topic>BONDS</topic><topic>Copper</topic><topic>HARDNESS</topic><topic>Heavy copper wire bonding</topic><topic>Initial conditions</topic><topic>Passive thermal cycling</topic><topic>Power electronics</topic><topic>Reliability</topic><topic>Shear</topic><topic>Shear strength</topic><topic>Thermal cycling</topic><topic>Three dimensional</topic><topic>ULTRASONICS</topic><topic>WIRE</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Arjmand, Elaheh</creatorcontrib><creatorcontrib>Agyakwa, Pearl A.</creatorcontrib><creatorcontrib>Corfield, Martin R.</creatorcontrib><creatorcontrib>Li, Jianfeng</creatorcontrib><creatorcontrib>Mouawad, Bassem</creatorcontrib><creatorcontrib>Mark Johnson, C.</creatorcontrib><collection>ScienceDirect Open Access Titles</collection><collection>Elsevier:ScienceDirect:Open Access</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronics and reliability</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Arjmand, Elaheh</au><au>Agyakwa, Pearl A.</au><au>Corfield, Martin R.</au><au>Li, Jianfeng</au><au>Mouawad, Bassem</au><au>Mark Johnson, C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A thermal cycling reliability study of ultrasonically bonded copper wires</atitle><jtitle>Microelectronics and reliability</jtitle><date>2016-04</date><risdate>2016</risdate><volume>59</volume><spage>126</spage><epage>133</epage><pages>126-133</pages><issn>0026-2714</issn><eissn>1872-941X</eissn><abstract>In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial conditions to 2900 passive thermal cycles from −55 to 125°C. Instead, an apparent increase in shear strength is observed as the number of thermal cycles increases. Nanoindentation hardness investigations suggest the occurrence of cyclic hardening. Microstructural investigations of the interfacial morphologies before and after cycling and after shear testing are also presented and discussed.
•A thermal cycling reliability study of ultrasonically bonded copper wires on Cu substrates is reported.•Results showed no discernible degradation or wear out from initial condition to 2900 passive thermal cycles from −55 to 125°C.•Results obtained from nanoindentation showed cyclic hardening that might explain the increase in shear force after cycling.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/j.microrel.2016.01.009</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0001-5019-8818</orcidid><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| source | Access via ScienceDirect (Elsevier) |
| subjects | BONDING BONDS Copper HARDNESS Heavy copper wire bonding Initial conditions Passive thermal cycling Power electronics Reliability Shear Shear strength Thermal cycling Three dimensional ULTRASONICS WIRE |
| title | A thermal cycling reliability study of ultrasonically bonded copper wires |
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