Analytical Solution for Electronic Assemblies Under Vibration

An analytical solution using Ritz method for the electronic assembly vibration problem has been presented in detail. In this solution, a special treatment for plate-mounted-on-standoffs boundary conditions scheme was required, and hence described. Also, a simple equation for estimating ball grid arr...

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Veröffentlicht in:	Journal of electronic packaging 2016-03, Vol.138 (1)
Hauptverfasser:	Gharaibeh, Mohammad A, Su, Quang T, Pitarresi, James M
Format:	Artikel
Sprache:	eng
Schlagworte:	Electronic assemblies Electronics Electronics packaging Finite element method Mathematical analysis Mathematical models Solders Vibration
Online-Zugang:	Volltext
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