Bi-modal Structure of Copper via Room-Temperature Partial Recrystallization After Cryogenic Dynamic Compression
P ure copper was compressed at high strain rates (over ~3 × 10 3 s −1 ) under liquid nitrogen. This deformation resulted in bi-modal microstructures of ultrafine grains and abnormally grown micro grains, and in greater hardness (by ~30 Hv) than room-temperature, dynamically deformed copper. This bi...
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| Veröffentlicht in: | Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2016-04, Vol.47 (4), p.1600-1606 |
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| container_issue | 4 |
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| container_title | Metallurgical and materials transactions. A, Physical metallurgy and materials science |
| container_volume | 47 |
| creator | Ahn, Dong-Hyun Lee, Dong Jun Kang, Minju Park, Lee Ju Lee, Sunghak Kim, Hyoung Seop |
| description | P
ure
copper was compressed at high strain rates (over ~3 × 10
3
s
−1
) under liquid nitrogen. This deformation resulted in bi-modal microstructures of ultrafine grains and abnormally grown micro grains, and in greater hardness (by ~30 Hv) than room-temperature, dynamically deformed copper. This bi-modal microstructure is attributable to partial recrystallization at room temperature, activated by high-energy states and by twins generated at high Zener–Hollomon parameter conditions. This result demonstrates a new approach for producing bi-modally structured materials. |
| doi_str_mv | 10.1007/s11661-016-3326-9 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1800486695</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1800486695</sourcerecordid><originalsourceid>FETCH-LOGICAL-c532t-d25b8a3373943674ba4e7b68b2d7e92dec6e00c3b6f1f926634209806178c7783</originalsourceid><addsrcrecordid>eNp1kU1LxDAQhoMouK7-AG8FL16i-WrSHNf6CQvKup5Dmk2XLm1Tk1aov96s9SCCp5khzzMMeQE4x-gKIySuA8acY4gwh5QSDuUBmOGUUYglQ4exR4LClBN6DE5C2CGEsKR8BtxNBRu30XXy2vvB9IO3iSuT3HWd9clHpZOVcw1c2ybO-vv5Rfu-isLKGj-GXtd19an7yrXJouyjlPvRbW1bmeR2bHUTa-6aztsQInMKjkpdB3v2U-fg7f5unT_C5fPDU75YQpNS0sMNSYtMUyqoZJQLVmhmRcGzgmyElWRjDbcIGVrwEpeScE4ZQTJDHIvMCJHRObic9nbevQ829KqpgrF1rVvrhqBwhhDLOJdpRC_-oDs3-DZep7AQmMWfSvcUnijjXQjelqrzVaP9qDBS-wjUFIGKEah9BEpGh0xOiGy7tf7X5n-lLwbZiRw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1771401955</pqid></control><display><type>article</type><title>Bi-modal Structure of Copper via Room-Temperature Partial Recrystallization After Cryogenic Dynamic Compression</title><source>SpringerLink Journals - AutoHoldings</source><creator>Ahn, Dong-Hyun ; Lee, Dong Jun ; Kang, Minju ; Park, Lee Ju ; Lee, Sunghak ; Kim, Hyoung Seop</creator><creatorcontrib>Ahn, Dong-Hyun ; Lee, Dong Jun ; Kang, Minju ; Park, Lee Ju ; Lee, Sunghak ; Kim, Hyoung Seop</creatorcontrib><description>P
ure
copper was compressed at high strain rates (over ~3 × 10
3
s
−1
) under liquid nitrogen. This deformation resulted in bi-modal microstructures of ultrafine grains and abnormally grown micro grains, and in greater hardness (by ~30 Hv) than room-temperature, dynamically deformed copper. This bi-modal microstructure is attributable to partial recrystallization at room temperature, activated by high-energy states and by twins generated at high Zener–Hollomon parameter conditions. This result demonstrates a new approach for producing bi-modally structured materials.</description><identifier>ISSN: 1073-5623</identifier><identifier>EISSN: 1543-1940</identifier><identifier>DOI: 10.1007/s11661-016-3326-9</identifier><identifier>CODEN: MMTAEB</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Compressing ; COMPRESSIVE PROPERTIES ; Copper ; COPPER (PURE) ; DEFORMATION ; Dynamic recrystallization ; GRAIN SIZE AND SHAPE ; Grains ; HARDNESS ; Liquid nitrogen ; Materials Science ; Metallic Materials ; Metallography ; Microstructure ; MICROSTRUCTURES ; Nanotechnology ; RECRYSTALLIZATION ; Strain rate ; Structural Materials ; Surfaces and Interfaces ; Thin Films</subject><ispartof>Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2016-04, Vol.47 (4), p.1600-1606</ispartof><rights>The Minerals, Metals & Materials Society and ASM International 2016</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c532t-d25b8a3373943674ba4e7b68b2d7e92dec6e00c3b6f1f926634209806178c7783</citedby><cites>FETCH-LOGICAL-c532t-d25b8a3373943674ba4e7b68b2d7e92dec6e00c3b6f1f926634209806178c7783</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11661-016-3326-9$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11661-016-3326-9$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Ahn, Dong-Hyun</creatorcontrib><creatorcontrib>Lee, Dong Jun</creatorcontrib><creatorcontrib>Kang, Minju</creatorcontrib><creatorcontrib>Park, Lee Ju</creatorcontrib><creatorcontrib>Lee, Sunghak</creatorcontrib><creatorcontrib>Kim, Hyoung Seop</creatorcontrib><title>Bi-modal Structure of Copper via Room-Temperature Partial Recrystallization After Cryogenic Dynamic Compression</title><title>Metallurgical and materials transactions. A, Physical metallurgy and materials science</title><addtitle>Metall Mater Trans A</addtitle><description>P
ure
copper was compressed at high strain rates (over ~3 × 10
3
s
−1
) under liquid nitrogen. This deformation resulted in bi-modal microstructures of ultrafine grains and abnormally grown micro grains, and in greater hardness (by ~30 Hv) than room-temperature, dynamically deformed copper. This bi-modal microstructure is attributable to partial recrystallization at room temperature, activated by high-energy states and by twins generated at high Zener–Hollomon parameter conditions. This result demonstrates a new approach for producing bi-modally structured materials.</description><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Compressing</subject><subject>COMPRESSIVE PROPERTIES</subject><subject>Copper</subject><subject>COPPER (PURE)</subject><subject>DEFORMATION</subject><subject>Dynamic recrystallization</subject><subject>GRAIN SIZE AND SHAPE</subject><subject>Grains</subject><subject>HARDNESS</subject><subject>Liquid nitrogen</subject><subject>Materials Science</subject><subject>Metallic Materials</subject><subject>Metallography</subject><subject>Microstructure</subject><subject>MICROSTRUCTURES</subject><subject>Nanotechnology</subject><subject>RECRYSTALLIZATION</subject><subject>Strain rate</subject><subject>Structural Materials</subject><subject>Surfaces and Interfaces</subject><subject>Thin Films</subject><issn>1073-5623</issn><issn>1543-1940</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>BENPR</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kU1LxDAQhoMouK7-AG8FL16i-WrSHNf6CQvKup5Dmk2XLm1Tk1aov96s9SCCp5khzzMMeQE4x-gKIySuA8acY4gwh5QSDuUBmOGUUYglQ4exR4LClBN6DE5C2CGEsKR8BtxNBRu30XXy2vvB9IO3iSuT3HWd9clHpZOVcw1c2ybO-vv5Rfu-isLKGj-GXtd19an7yrXJouyjlPvRbW1bmeR2bHUTa-6aztsQInMKjkpdB3v2U-fg7f5unT_C5fPDU75YQpNS0sMNSYtMUyqoZJQLVmhmRcGzgmyElWRjDbcIGVrwEpeScE4ZQTJDHIvMCJHRObic9nbevQ829KqpgrF1rVvrhqBwhhDLOJdpRC_-oDs3-DZep7AQmMWfSvcUnijjXQjelqrzVaP9qDBS-wjUFIGKEah9BEpGh0xOiGy7tf7X5n-lLwbZiRw</recordid><startdate>20160401</startdate><enddate>20160401</enddate><creator>Ahn, Dong-Hyun</creator><creator>Lee, Dong Jun</creator><creator>Kang, Minju</creator><creator>Park, Lee Ju</creator><creator>Lee, Sunghak</creator><creator>Kim, Hyoung Seop</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>4T-</scope><scope>4U-</scope><scope>7SR</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope><scope>H8G</scope></search><sort><creationdate>20160401</creationdate><title>Bi-modal Structure of Copper via Room-Temperature Partial Recrystallization After Cryogenic Dynamic Compression</title><author>Ahn, Dong-Hyun ; Lee, Dong Jun ; Kang, Minju ; Park, Lee Ju ; Lee, Sunghak ; Kim, Hyoung Seop</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c532t-d25b8a3373943674ba4e7b68b2d7e92dec6e00c3b6f1f926634209806178c7783</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Compressing</topic><topic>COMPRESSIVE PROPERTIES</topic><topic>Copper</topic><topic>COPPER (PURE)</topic><topic>DEFORMATION</topic><topic>Dynamic recrystallization</topic><topic>GRAIN SIZE AND SHAPE</topic><topic>Grains</topic><topic>HARDNESS</topic><topic>Liquid nitrogen</topic><topic>Materials Science</topic><topic>Metallic Materials</topic><topic>Metallography</topic><topic>Microstructure</topic><topic>MICROSTRUCTURES</topic><topic>Nanotechnology</topic><topic>RECRYSTALLIZATION</topic><topic>Strain rate</topic><topic>Structural Materials</topic><topic>Surfaces and Interfaces</topic><topic>Thin Films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ahn, Dong-Hyun</creatorcontrib><creatorcontrib>Lee, Dong Jun</creatorcontrib><creatorcontrib>Kang, Minju</creatorcontrib><creatorcontrib>Park, Lee Ju</creatorcontrib><creatorcontrib>Lee, Sunghak</creatorcontrib><creatorcontrib>Kim, Hyoung Seop</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>Docstoc</collection><collection>University Readers</collection><collection>Engineered Materials Abstracts</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>https://resources.nclive.org/materials</collection><collection>ProQuest Engineering Collection</collection><collection>ProQuest Research Library</collection><collection>ProQuest Science Journals</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><collection>Copper Technical Reference Library</collection><jtitle>Metallurgical and materials transactions. A, Physical metallurgy and materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ahn, Dong-Hyun</au><au>Lee, Dong Jun</au><au>Kang, Minju</au><au>Park, Lee Ju</au><au>Lee, Sunghak</au><au>Kim, Hyoung Seop</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Bi-modal Structure of Copper via Room-Temperature Partial Recrystallization After Cryogenic Dynamic Compression</atitle><jtitle>Metallurgical and materials transactions. A, Physical metallurgy and materials science</jtitle><stitle>Metall Mater Trans A</stitle><date>2016-04-01</date><risdate>2016</risdate><volume>47</volume><issue>4</issue><spage>1600</spage><epage>1606</epage><pages>1600-1606</pages><issn>1073-5623</issn><eissn>1543-1940</eissn><coden>MMTAEB</coden><abstract>P
ure
copper was compressed at high strain rates (over ~3 × 10
3
s
−1
) under liquid nitrogen. This deformation resulted in bi-modal microstructures of ultrafine grains and abnormally grown micro grains, and in greater hardness (by ~30 Hv) than room-temperature, dynamically deformed copper. This bi-modal microstructure is attributable to partial recrystallization at room temperature, activated by high-energy states and by twins generated at high Zener–Hollomon parameter conditions. This result demonstrates a new approach for producing bi-modally structured materials.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11661-016-3326-9</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2016-04, Vol.47 (4), p.1600-1606 |
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| subjects | Characterization and Evaluation of Materials Chemistry and Materials Science Compressing COMPRESSIVE PROPERTIES Copper COPPER (PURE) DEFORMATION Dynamic recrystallization GRAIN SIZE AND SHAPE Grains HARDNESS Liquid nitrogen Materials Science Metallic Materials Metallography Microstructure MICROSTRUCTURES Nanotechnology RECRYSTALLIZATION Strain rate Structural Materials Surfaces and Interfaces Thin Films |
| title | Bi-modal Structure of Copper via Room-Temperature Partial Recrystallization After Cryogenic Dynamic Compression |
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