A Novel Tape and Diamond Process Developed for Polishing Hard Substrates

A nanoscale polish process with improved desired characteristics of low roughness and low scratch counts has been developed using a novel polish tape and diamond abrasive on hard glass substrates. For an improved polishing performance with high removal rate properties and preventing scratches, a nov...

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Bibliographische Detailangaben

Veröffentlicht in:	Key Engineering Materials 2015, Vol.656-657, p.416-421
Hauptverfasser:	Lee, Cheng Kuo, Yeh, Rong Hwei, Chao, T.M., Tan, A.H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Carbon Counting Diamonds Fibers Nanostructure Polished Polishes Polishing
Online-Zugang:	Volltext
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