Preparation and properties of thermally conductive polyimide/boron nitride composites

Polyimide (PI) has been widely used as a preferred packaging matrix material due to its low dielectricity, outstanding insulation and excellent thermal stability. Hexagonal boron nitride (h-BN) microparticles were functionalized with a silane coupling agent, 3-glycidyloxypropyltrimethoxy silane (γ-M...

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Veröffentlicht in:	RSC advances 2016-01, Vol.6 (22), p.18279-18287
Hauptverfasser:	Yang, Na, Xu, Chen, Hou, Jun, Yao, Yanmei, Zhang, Qingxin, Grami, Maryam E, He, Lianqi, Wang, Nongyue, Qu, Xiongwei
Format:	Artikel
Sprache:	eng
Schlagworte:	Boron nitride Coupling agents Fourier transforms Heat transfer Particulate composites Silanes Thermal conductivity Transmission electron microscopy
Online-Zugang:	Volltext
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