Enhanced Thermal Conductivity in Polyimide/Silver Particle Composite Films Based on Spontaneous Formation of Thermal Conductive Paths

A series of polyimide (PI)/silver composite films incorporating μm-sized metallic silver particles (Ag-MPs) were prepared using matrices of sulfur- (SD), fluorine- (TF), and silicon-containing (SIM) PIs as well as an immiscible blend of SD- and TF-PIs (b-SF). The thermal conductivity (λ⊥) of the com...

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Veröffentlicht in:	Journal of Photopolymer Science and Technology 2014/07/08, Vol.27(2), pp.187-191
Hauptverfasser:	Murakami, Tomoya, Ebisawa, Kazuaki, Miyao, Kenji, Ando, Shinji
Format:	Artikel
Sprache:	eng
Schlagworte:	Dispersions Equivalence Heat transfer Particulate composites Polyimide Polyimide resins polymer-metal composite Silver SIM Thermal conductivity thin film
Online-Zugang:	Volltext
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