Lattice Boltzmann method study of bga bump arrangements on void formation

This paper studies effects of different bump orientations on the void formation using Lattice Boltzmann method (LBM) based software. Prediction of air void is vital typically at the onset of reflow soldering which could reduce the reliability of the mold cavity. The effect of variations in pressure...

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Veröffentlicht in:	Microelectronics and reliability 2016-01, Vol.56, p.170-181
Hauptverfasser:	Abas, Aizat, Ishak, M.H.H., Abdullah, M.Z., Che Ani, F., Khor, Soon Fuat
Format:	Artikel
Sprache:	eng
Schlagworte:	Air void Ball grid array BGA Capillary underfill Encapsulation Finite volume method Formations Lattice Boltzmann method Low pressure Molds Orientation Reflow soldering Voids
Online-Zugang:	Volltext
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