Molecular Dynamics Simulation of Dislocation Behavior in TiAl Intermetallic Compound

TiAl intermetallic compound has received much attention as a lightweight heat resistant material. Because mechanical property is affected by dislocation behavior, it is important to understand dislocation behavior in microscopic viewpoint. In this study, we simulated dislocation behavior in single p...

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Veröffentlicht in:	Journal of the Japan Institute of Metals and Materials 2015, Vol.79(8), pp.413-418
Hauptverfasser:	Takeuchi, Shunichi, Kawamura, Takahiro, Suzuki, Yasuyuki, Kitashima, Tomonori
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Aluminides dislocation Dislocations Intermetallic compounds Intermetallics Molecular dynamics Simulation stacking fault Titanium aluminides Titanium base alloys Titanium compounds titanium-aluminum intermetallic compound
Online-Zugang:	Volltext
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