Top contact organic field effect transistors fabricated using a photolithographic process

This paper proposes an effective method of fabricating top contact organic field effect transistors by using a pho- tolithographic process. The semiconductor layer is protected by a passivation layer. Through photolithographic and etching processes, parts of the passivation layer are etched off to f...

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Veröffentlicht in:Chinese physics B 2011-08, Vol.20 (8), p.389-393, Article 087306
Hauptverfasser: Wang, Hong, Ji, Zhuo-Yu, Shang, Li-Wei, Liu, Xing-Hua, Peng, Ying-Quan, Liu, Ming
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container_end_page 393
container_issue 8
container_start_page 389
container_title Chinese physics B
container_volume 20
creator Wang, Hong
Ji, Zhuo-Yu
Shang, Li-Wei
Liu, Xing-Hua
Peng, Ying-Quan
Liu, Ming
description This paper proposes an effective method of fabricating top contact organic field effect transistors by using a pho- tolithographic process. The semiconductor layer is protected by a passivation layer. Through photolithographic and etching processes, parts of the passivation layer are etched off to form source/drain electrode patterns. Combined with conventional evaporation and lift-off techniques, organic field effect transistors with a top contact are fabricated suc- cessfully, whose properties are comparable to those prepared with the shadow mask method and one order of magnitude higher than the bottom contact devices fabricated by using a photolithographic process.
doi_str_mv 10.1088/1674-1056/20/8/087306
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subjects Contact
Electrodes
Etching
Field effect transistors
Passivation
Photolithography
Semiconductor devices
Semiconductors
光刻工艺
半导体层
工艺制造
有机场效应晶体管
级联
荫罩
蚀刻工艺
钝化层
title Top contact organic field effect transistors fabricated using a photolithographic process
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