Bonding of Al to Al2O3 via Al–Cu eutectic method

The Al oxidation layer in the manufactures of direct aluminum bonded Al2O3 substrates (DAB) has been a long-term trouble for industries. In this work we propose a new method for fabricating the DAB substrates with no requirement of high vacuum or active O2-getters. The new method comprises two stage...

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Veröffentlicht in:	Materials & design 2015-12, Vol.87, p.619-624
Hauptverfasser:	Zhang, Pengfei, Fang, Jun, Fu, Renli, Gu, Xiguang, Fei, Meng
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding Aluminum Aluminum oxide Al–Cu eutectic Bonding Copper DAB substrate Diffusion Eutectics Foils KF–AlF3 flux Surface chemistry Thermal properties
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