Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn-Cu solder or solid Sn-Cu solder at 222 degree C: Experimental results versus theoretical model calculations

Interfacial reactions between a Cu substrate and a metastable supercooled liquid Sn-Cu solder at 222 degree C are studied for the first time. The principal aim of this study is to compare the differences between Cu/solid Sn and Cu/metastable liquid Sn interfacial reactions at a rigorously identical...

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Veröffentlicht in:	Acta materialia 2015-10, Vol.99, p.106-118
Hauptverfasser:	Liashenko, OYu, Hodaj, F
Format:	Artikel
Sprache:	eng
Schlagworte:	Copper Interface reactions Liquids Morphology Reaction kinetics Solders Tin Tin base alloys
Online-Zugang:	Volltext
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