Competing Fracture of Thin-Chip Transferring From/Onto Prestrained Compliant Substrate

The transferring of thin chip from donor to receptor plays a critical role in advanced electronic package, and the productivity is determined by the interfacial behavior between chip and substrate during chip transferring. The paper investigates analytical competing fracture model of chip–adhesive–s...

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Veröffentlicht in:	Journal of applied mechanics 2015-10, Vol.82 (10)
Hauptverfasser:	Liu, Huimin, Liu, Zunxu, Xu, Zhoulong, Yin, Zhouping, Huang, YongAn, Chen, Jiankui
Format:	Artikel
Sprache:	eng
Schlagworte:	Chips Computer simulation Fracture mechanics Loads (forces) Mathematical analysis Needles Productivity Stress concentration
Online-Zugang:	Volltext
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