Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics

A novel method relying on strain engineering to realize arrays of on‐chip‐integrated giant magneto‐impedance (GMI) sensors equipped with pick‐up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic dom...

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Veröffentlicht in:	Advanced materials (Weinheim) 2015-11, Vol.27 (42), p.6582-6589
Hauptverfasser:	Karnaushenko, Daniil, Karnaushenko, Dmitriy D., Makarov, Denys, Baunack, Stefan, Schäfer, Rudolf, Schmidt, Oliver G.
Format:	Artikel
Sprache:	eng
Schlagworte:	CMOS Coils Electric Impedance Electrical Equipment and Supplies Electrodes Equipment Design flexible electronics Foundations Magnetic domains magnetic field sensors Magnetic Fields magneto-impedance Magnetoencephalography - instrumentation Magnetoimpedance Microtechnology - instrumentation Microtechnology - methods self-assembly Strain strain engineering Three dimensional Transformations
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Beschreibung
Zusammenfassung:	A novel method relying on strain engineering to realize arrays of on‐chip‐integrated giant magneto‐impedance (GMI) sensors equipped with pick‐up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic domain patterns. This work creates a solid foundation for further development of CMOS compatible GMI sensorics for magnetoencephalography.
ISSN:	0935-9648 1521-4095
DOI:	10.1002/adma.201503127