Large scale Molecular Dynamics simulation of microstructure formation during thermal spraying of pure copper

Thermal spray processes are widely used for the manufacture of advanced coating systems, e.g. metallic coatings for wear and corrosion protection. The desired coating properties are closely related to the microstructure, which is highly influenced by the processing parameters, such as temperature, s...

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Veröffentlicht in:Surface & coatings technology 2015-10, Vol.280, p.72-80
Hauptverfasser: Wang, Tao, Begau, Christoph, Sutmann, Godehard, Hartmaier, Alexander
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Sutmann, Godehard
Hartmaier, Alexander
description Thermal spray processes are widely used for the manufacture of advanced coating systems, e.g. metallic coatings for wear and corrosion protection. The desired coating properties are closely related to the microstructure, which is highly influenced by the processing parameters, such as temperature, size and velocity of the sprayed particles. In this paper, large scale Molecular Dynamics simulations are conducted to investigate the microstructure formation mechanisms during the spraying process of hot nano-particles onto a substrate at room temperature using pure copper as a benchmark material representing for a wider class of face-centered-cubic metals. To evaluate the influence of processing parameters on the coating morphology, a number of simulations are performed in which the initial temperature, size and velocity of copper particles are systematically varied in order to investigate the thermal and microstructural evolution during impaction. Two distinct types of microstructural formation mechanisms, resulting in different coating morphologies, are observed in the present investigation, which are either governed by plastic deformation or by the process of melting and subsequent solidification. Furthermore, a thermodynamically motivated model as a function of the particle temperature and velocity is developed, which predicts the microstructural mechanisms observed in the simulations. The results provide an elementary insight into the microstructure formation mechanisms on an atomistic scale, which can serve as basic input for continuum modeling of thermal spray process. •Thermal spray process is simulated by large-scale Molecular Dynamics method.•Single and multiple nano-particle spraying processes are simulated.•Processing parameters that influence the coating structures are investigated.•Structures are formed by deformation or melting/solidification mechanisms.•Thermodynamic modeling confirms the similar results as MD predictions.
doi_str_mv 10.1016/j.surfcoat.2015.08.034
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Two distinct types of microstructural formation mechanisms, resulting in different coating morphologies, are observed in the present investigation, which are either governed by plastic deformation or by the process of melting and subsequent solidification. Furthermore, a thermodynamically motivated model as a function of the particle temperature and velocity is developed, which predicts the microstructural mechanisms observed in the simulations. 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subjects Coating
COATINGS
COMPUTER SIMULATION
Copper
COPPER (PURE)
CORROSION
Formations
MATHEMATICAL ANALYSIS
Mathematical models
Microstructure
MICROSTRUCTURES
Molecular Dynamics
PARAMETERS
Process parameters
Simulation
Solidification
SPRAYING
Structural zone
Thermal spray
title Large scale Molecular Dynamics simulation of microstructure formation during thermal spraying of pure copper
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