Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron

Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing o...

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Veröffentlicht in:	Rare metals 2015-11, Vol.34 (11), p.783-788
Hauptverfasser:	Qu, Jun-Feng, Xu, Jun, Hu, Qiang, Zhang, Fu-Wen, Zhang, Shao-Ming
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Biomaterials Chemistry and Materials Science Energy Grain size Lead-free Materials Engineering Materials Science Metallic Materials Microstructure Nanoscale Science and Technology Nickel Physical Chemistry reacti Reinforcement Shear tests solder Sn–1.0Ag–0.5Cu Interfacial Solders Tin Tin base alloys
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