Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron
Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing o...
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| Veröffentlicht in: | Rare metals 2015-11, Vol.34 (11), p.783-788 |
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| creator | Qu, Jun-Feng Xu, Jun Hu, Qiang Zhang, Fu-Wen Zhang, Shao-Ming |
| description | Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy. |
| doi_str_mv | 10.1007/s12598-014-0221-7 |
| format | Article |
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Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy.</description><identifier>ISSN: 1001-0521</identifier><identifier>EISSN: 1867-7185</identifier><identifier>DOI: 10.1007/s12598-014-0221-7</identifier><language>eng</language><publisher>Beijing: Nonferrous Metals Society of China</publisher><subject>Alloys ; Biomaterials ; Chemistry and Materials Science ; Energy ; Grain size ; Lead-free ; Materials Engineering ; Materials Science ; Metallic Materials ; Microstructure ; Nanoscale Science and Technology ; Nickel ; Physical Chemistry ; reacti ; Reinforcement ; Shear tests ; solder;Sn–1.0Ag–0.5Cu;Interfacial ; Solders ; Tin ; Tin base alloys</subject><ispartof>Rare metals, 2015-11, Vol.34 (11), p.783-788</ispartof><rights>The Nonferrous Metals Society of China and Springer-Verlag Berlin Heidelberg 2014</rights><rights>The Nonferrous Metals Society of China and Springer-Verlag Berlin Heidelberg 2015</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c463t-39affb4efefdf84bc7600fb82c53a62f58ed0258b74e4315b4583a4b1ddfdc8c3</citedby><cites>FETCH-LOGICAL-c463t-39affb4efefdf84bc7600fb82c53a62f58ed0258b74e4315b4583a4b1ddfdc8c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://image.cqvip.com/vip1000/qk/85314X/85314X.jpg</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s12598-014-0221-7$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s12598-014-0221-7$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>315,781,785,27929,27930,41493,42562,51324</link.rule.ids></links><search><creatorcontrib>Qu, Jun-Feng</creatorcontrib><creatorcontrib>Xu, Jun</creatorcontrib><creatorcontrib>Hu, Qiang</creatorcontrib><creatorcontrib>Zhang, Fu-Wen</creatorcontrib><creatorcontrib>Zhang, Shao-Ming</creatorcontrib><title>Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron</title><title>Rare metals</title><addtitle>Rare Met</addtitle><addtitle>Rare Metals</addtitle><description>Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy.</description><subject>Alloys</subject><subject>Biomaterials</subject><subject>Chemistry and Materials Science</subject><subject>Energy</subject><subject>Grain size</subject><subject>Lead-free</subject><subject>Materials Engineering</subject><subject>Materials Science</subject><subject>Metallic Materials</subject><subject>Microstructure</subject><subject>Nanoscale Science and Technology</subject><subject>Nickel</subject><subject>Physical Chemistry</subject><subject>reacti</subject><subject>Reinforcement</subject><subject>Shear tests</subject><subject>solder;Sn–1.0Ag–0.5Cu;Interfacial</subject><subject>Solders</subject><subject>Tin</subject><subject>Tin base alloys</subject><issn>1001-0521</issn><issn>1867-7185</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9kLFOHDEQhlcokSCQB0i3Upo0e8zY4_VsF3QKSSQQBVBbu177smSxwb4t6HgH3jBPEqNDKKKIppgpvn9m9FXVJ4QVAujjjEJ13ABSA0Jgo_eqA-RWNxpZvSszADagBO5XH3K-ASBqWziovp7HcfKT7bdTDHX09WX48_iEKzjZlA4rtV7qHOfRpXrJU9jUYbK_3Vz3YayHmGI4qt77fs7u40s_rK5Pv12tfzRnF99_rk_OGkut3Day670fyHnnR880WN0C-IGFVbJvhVfsRhCKB02OJKqBFMueBhxHP1q28rD6stt7l-L94vLW3E7Zunnug4tLNqhbAVppooJ-foPexCWF8l2hkIsp2WKhcEfZFHNOzpu7NN326cEgmGenZufUFKfm2anRJSN2mVzYsHHpn83_CcmXQ79i2NyX3OslZu40sVRATJ2S1JViYiXlX7aBiEU</recordid><startdate>20151101</startdate><enddate>20151101</enddate><creator>Qu, Jun-Feng</creator><creator>Xu, Jun</creator><creator>Hu, Qiang</creator><creator>Zhang, Fu-Wen</creator><creator>Zhang, Shao-Ming</creator><general>Nonferrous Metals Society of China</general><general>Springer Nature B.V</general><scope>2RA</scope><scope>92L</scope><scope>CQIGP</scope><scope>W92</scope><scope>~WA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope></search><sort><creationdate>20151101</creationdate><title>Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron</title><author>Qu, Jun-Feng ; Xu, Jun ; Hu, Qiang ; Zhang, Fu-Wen ; Zhang, Shao-Ming</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c463t-39affb4efefdf84bc7600fb82c53a62f58ed0258b74e4315b4583a4b1ddfdc8c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Alloys</topic><topic>Biomaterials</topic><topic>Chemistry and Materials Science</topic><topic>Energy</topic><topic>Grain size</topic><topic>Lead-free</topic><topic>Materials Engineering</topic><topic>Materials Science</topic><topic>Metallic Materials</topic><topic>Microstructure</topic><topic>Nanoscale Science and Technology</topic><topic>Nickel</topic><topic>Physical Chemistry</topic><topic>reacti</topic><topic>Reinforcement</topic><topic>Shear tests</topic><topic>solder;Sn–1.0Ag–0.5Cu;Interfacial</topic><topic>Solders</topic><topic>Tin</topic><topic>Tin base alloys</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Qu, Jun-Feng</creatorcontrib><creatorcontrib>Xu, Jun</creatorcontrib><creatorcontrib>Hu, Qiang</creatorcontrib><creatorcontrib>Zhang, Fu-Wen</creatorcontrib><creatorcontrib>Zhang, Shao-Ming</creatorcontrib><collection>中文科技期刊数据库</collection><collection>中文科技期刊数据库-CALIS站点</collection><collection>中文科技期刊数据库-7.0平台</collection><collection>中文科技期刊数据库-工程技术</collection><collection>中文科技期刊数据库- 镜像站点</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><jtitle>Rare metals</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Qu, Jun-Feng</au><au>Xu, Jun</au><au>Hu, Qiang</au><au>Zhang, Fu-Wen</au><au>Zhang, Shao-Ming</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron</atitle><jtitle>Rare metals</jtitle><stitle>Rare Met</stitle><addtitle>Rare Metals</addtitle><date>2015-11-01</date><risdate>2015</risdate><volume>34</volume><issue>11</issue><spage>783</spage><epage>788</epage><pages>783-788</pages><issn>1001-0521</issn><eissn>1867-7185</eissn><abstract>Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy.</abstract><cop>Beijing</cop><pub>Nonferrous Metals Society of China</pub><doi>10.1007/s12598-014-0221-7</doi><tpages>6</tpages></addata></record> |
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| source | SpringerNature Journals; Alma/SFX Local Collection |
| subjects | Alloys Biomaterials Chemistry and Materials Science Energy Grain size Lead-free Materials Engineering Materials Science Metallic Materials Microstructure Nanoscale Science and Technology Nickel Physical Chemistry reacti Reinforcement Shear tests solder Sn–1.0Ag–0.5Cu Interfacial Solders Tin Tin base alloys |
| title | Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron |
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