Thermal Ratcheting of Solder-Bonded Layered Plates

The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and Cu layers in finite element analysis. The warpage...

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Veröffentlicht in:	Key engineering materials 2014-08, Vol.626, p.178-181
Hauptverfasser:	Tanie, Hisashi, Ohno, Nobutada, Mizushima, Satoshi
Format:	Artikel
Sprache:	eng
Schlagworte:	Copper Cyclic loads Fatigue (materials) Plates Ratcheting Recovery Serrated yielding Solders Warpage
Online-Zugang:	Volltext
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