Thermal Ratcheting of Solder-Bonded Layered Plates
The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and Cu layers in finite element analysis. The warpage...
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| Veröffentlicht in: | Key engineering materials 2014-08, Vol.626, p.178-181 |
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| creator | Mizushima, Satoshi Ohno, Nobutada Tanie, Hisashi |
| description | The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and Cu layers in finite element analysis. The warpage growth/recovery behavior observed was reproduced well in the analysis using the Armstrong-Frederick and Ohno-Wang models for the solder and Cu layers, respectively. Material ratcheting due to non-proportional cyclic loading was found to happen in the solder layer as a consequence of the CTE mismatch, while material ratcheting due to proportional cyclic loading occurred in the Cu layer as a result of the significant temperature dependence of viscoplasticity in the solder layer. |
| doi_str_mv | 10.4028/www.scientific.net/KEM.626.178 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1753522639</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1753522639</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2768-4a1e8654b04a104308f590362c51b3f966bba60eb2d54d3d2f615bf23561e9493</originalsourceid><addsrcrecordid>eNqNkF1LwzAYhYMoOKf_oVfiTbt8NGl6I-qYH1hRdF6HNH3jOrp2Jhlj_96MCd56dc7F4YHzIHRJcJZjKifb7TbzpoU-tLY1WQ9h8jx7yQQVGSnkERoRIWhaFiU_jh0TlpaSilN05v0SY0Yk4SNE5wtwK90l7zqYBYS2_0oGm3wMXQMuvRv6Bpqk0jtwMd86HcCfoxOrOw8XvzlGn_ez-fQxrV4fnqa3VWpoIWSaawJS8LzGseGcYWl5iZmghpOa2VKIutYCQ00bnjesoVYQXlvKuCBQ5iUbo6sDd-2G7w34oFatN9B1uodh4xUpOOOUCrafXh-mxg3eO7Bq7dqVdjtFsNrLUlGW-pOloiwVZakoK3JkBNwcAMHp3gcwC7UcNq6P__6L-AH3aHmn</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1753522639</pqid></control><display><type>article</type><title>Thermal Ratcheting of Solder-Bonded Layered Plates</title><source>Scientific.net Journals</source><creator>Mizushima, Satoshi ; Ohno, Nobutada ; Tanie, Hisashi</creator><creatorcontrib>Mizushima, Satoshi ; Ohno, Nobutada ; Tanie, Hisashi</creatorcontrib><description>The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and Cu layers in finite element analysis. The warpage growth/recovery behavior observed was reproduced well in the analysis using the Armstrong-Frederick and Ohno-Wang models for the solder and Cu layers, respectively. Material ratcheting due to non-proportional cyclic loading was found to happen in the solder layer as a consequence of the CTE mismatch, while material ratcheting due to proportional cyclic loading occurred in the Cu layer as a result of the significant temperature dependence of viscoplasticity in the solder layer.</description><identifier>ISSN: 1013-9826</identifier><identifier>ISSN: 1662-9795</identifier><identifier>EISSN: 1662-9795</identifier><identifier>DOI: 10.4028/www.scientific.net/KEM.626.178</identifier><language>eng</language><publisher>Trans Tech Publications Ltd</publisher><subject>Copper ; Cyclic loads ; Fatigue (materials) ; Plates ; Ratcheting ; Recovery ; Serrated yielding ; Solders ; Warpage</subject><ispartof>Key engineering materials, 2014-08, Vol.626, p.178-181</ispartof><rights>2015 Trans Tech Publications Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c2768-4a1e8654b04a104308f590362c51b3f966bba60eb2d54d3d2f615bf23561e9493</citedby><cites>FETCH-LOGICAL-c2768-4a1e8654b04a104308f590362c51b3f966bba60eb2d54d3d2f615bf23561e9493</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/3432?width=600</thumbnail><link.rule.ids>315,781,785,27926,27927</link.rule.ids></links><search><creatorcontrib>Mizushima, Satoshi</creatorcontrib><creatorcontrib>Ohno, Nobutada</creatorcontrib><creatorcontrib>Tanie, Hisashi</creatorcontrib><title>Thermal Ratcheting of Solder-Bonded Layered Plates</title><title>Key engineering materials</title><description>The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and Cu layers in finite element analysis. The warpage growth/recovery behavior observed was reproduced well in the analysis using the Armstrong-Frederick and Ohno-Wang models for the solder and Cu layers, respectively. Material ratcheting due to non-proportional cyclic loading was found to happen in the solder layer as a consequence of the CTE mismatch, while material ratcheting due to proportional cyclic loading occurred in the Cu layer as a result of the significant temperature dependence of viscoplasticity in the solder layer.</description><subject>Copper</subject><subject>Cyclic loads</subject><subject>Fatigue (materials)</subject><subject>Plates</subject><subject>Ratcheting</subject><subject>Recovery</subject><subject>Serrated yielding</subject><subject>Solders</subject><subject>Warpage</subject><issn>1013-9826</issn><issn>1662-9795</issn><issn>1662-9795</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNqNkF1LwzAYhYMoOKf_oVfiTbt8NGl6I-qYH1hRdF6HNH3jOrp2Jhlj_96MCd56dc7F4YHzIHRJcJZjKifb7TbzpoU-tLY1WQ9h8jx7yQQVGSnkERoRIWhaFiU_jh0TlpaSilN05v0SY0Yk4SNE5wtwK90l7zqYBYS2_0oGm3wMXQMuvRv6Bpqk0jtwMd86HcCfoxOrOw8XvzlGn_ez-fQxrV4fnqa3VWpoIWSaawJS8LzGseGcYWl5iZmghpOa2VKIutYCQ00bnjesoVYQXlvKuCBQ5iUbo6sDd-2G7w34oFatN9B1uodh4xUpOOOUCrafXh-mxg3eO7Bq7dqVdjtFsNrLUlGW-pOloiwVZakoK3JkBNwcAMHp3gcwC7UcNq6P__6L-AH3aHmn</recordid><startdate>20140801</startdate><enddate>20140801</enddate><creator>Mizushima, Satoshi</creator><creator>Ohno, Nobutada</creator><creator>Tanie, Hisashi</creator><general>Trans Tech Publications Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>JG9</scope></search><sort><creationdate>20140801</creationdate><title>Thermal Ratcheting of Solder-Bonded Layered Plates</title><author>Mizushima, Satoshi ; Ohno, Nobutada ; Tanie, Hisashi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2768-4a1e8654b04a104308f590362c51b3f966bba60eb2d54d3d2f615bf23561e9493</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Copper</topic><topic>Cyclic loads</topic><topic>Fatigue (materials)</topic><topic>Plates</topic><topic>Ratcheting</topic><topic>Recovery</topic><topic>Serrated yielding</topic><topic>Solders</topic><topic>Warpage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Mizushima, Satoshi</creatorcontrib><creatorcontrib>Ohno, Nobutada</creatorcontrib><creatorcontrib>Tanie, Hisashi</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><jtitle>Key engineering materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Mizushima, Satoshi</au><au>Ohno, Nobutada</au><au>Tanie, Hisashi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermal Ratcheting of Solder-Bonded Layered Plates</atitle><jtitle>Key engineering materials</jtitle><date>2014-08-01</date><risdate>2014</risdate><volume>626</volume><spage>178</spage><epage>181</epage><pages>178-181</pages><issn>1013-9826</issn><issn>1662-9795</issn><eissn>1662-9795</eissn><abstract>The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and Cu layers in finite element analysis. The warpage growth/recovery behavior observed was reproduced well in the analysis using the Armstrong-Frederick and Ohno-Wang models for the solder and Cu layers, respectively. Material ratcheting due to non-proportional cyclic loading was found to happen in the solder layer as a consequence of the CTE mismatch, while material ratcheting due to proportional cyclic loading occurred in the Cu layer as a result of the significant temperature dependence of viscoplasticity in the solder layer.</abstract><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/KEM.626.178</doi><tpages>4</tpages></addata></record> |
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| subjects | Copper Cyclic loads Fatigue (materials) Plates Ratcheting Recovery Serrated yielding Solders Warpage |
| title | Thermal Ratcheting of Solder-Bonded Layered Plates |
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