The Study of Nickel on Copper Nitride Thin Films Deposited by Magnetron Sputtering

Ni-doped copper nitride films have been prepared by co-sputtering of Ni and Cu targets. The addition of Ni to Cu3N films reduced the intensity of the (111) diffraction peak, and lead a little angular shifts of the peaks. The films showed a large difference in reflectance in the infrared and visible...

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Veröffentlicht in:Key engineering materials 2014-12, Vol.636, p.29-32
Hauptverfasser: Yang, Jian Bo, Han, Jia, Li, Xing Ao, Yang, Tao, Yang, Rong, Yang, Jian Ping, Gu, Min Fen, Liu, Wen Jie
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container_title Key engineering materials
container_volume 636
creator Yang, Jian Bo
Han, Jia
Li, Xing Ao
Yang, Tao
Yang, Rong
Yang, Jian Ping
Gu, Min Fen
Liu, Wen Jie
description Ni-doped copper nitride films have been prepared by co-sputtering of Ni and Cu targets. The addition of Ni to Cu3N films reduced the intensity of the (111) diffraction peak, and lead a little angular shifts of the peaks. The films showed a large difference in reflectance in the infrared and visible before and after thermal decomposition, which is applicable to optical recording media. The films change from a semiconductor to a conductor with the increased ratio of Ni in Cu3N films.
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subjects Copper
COPPER NITRIDE
DEPOSITION
Diffraction
Infrared
Nickel
Nitrides
Reflectivity
SEMICONDUCTORS
SPUTTERING
THIN FILMS
title The Study of Nickel on Copper Nitride Thin Films Deposited by Magnetron Sputtering
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