Analysis of the Curing Reaction of the Epoxy Resin Composition by Pulsed super(1)H-NMR and Adhesive Properties

Epoxy thermoset materials are applied to a number of industrial products as a matrix of adhesive, and they are driving the technical progression of light weight organic-inorganic composite equipment. The precise design of materials is important in order to satisfy the required properties according t...

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Veröffentlicht in:	Shikizai Kyōkai shi 2015-08, Vol.88 (5), p.125-131
Hauptverfasser:	Ichikawa, Isao, Suzuki, Hideaki, Sugizaki, Toshio, Asai, Shigeo
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesion Adhesives Curing Design engineering Molecular weight Semiconductors Thermosetting resins Weight reduction
Online-Zugang:	Volltext
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