Interfacial characterization of SLM parts in multi-material processing: Intermetallic phase formation between AlSi10Mg and C18400 copper alloy

Multi-material processing in selective laser melting (SLM) using AlSi10Mg and UNS C18400 copper alloy was carried out. The interfacial characteristics were analyzed with FIB, SEM, XRD, EDS and EBSD techniques. Al2Cu intermetallic compound was formed at the Al/Cu bond interface after the SLM process....

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Veröffentlicht in:	Materials characterization 2015-09, Vol.107, p.220-227
Hauptverfasser:	Sing, S.L., Lam, L.P., Zhang, D.Q., Liu, Z.H., Chua, C.K.
Format:	Artikel
Sprache:	eng
Schlagworte:	3D printing Additive manufacturing Aluminum ALUMINUM ALLOYS (50 TO 99 AL) Aluminum base alloys Copper COPPER ALLOYS (40 TO 99.3 CU) Copper base alloys Formations FRACTURE MECHANICS HARDNESS INTERFACES Intermetallic compounds Intermetallics Microhardness Multi-material PHASES Rapid prototyping Roots Selective laser melting TENSILE STRENGTH
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