AlN thin film growth using electron cyclotron resonance reactive sputtering

In this report, we investigated conditions to deposit stoichiometric aluminium nitride (AlN) thin films grown on (100)-oriented Si substrates under various Ar/N2 gas flow rates at a wide range of temperature from room temperature (RT) to 350°C using electron cyclotron resonance (ECR) reactive sputte...

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Veröffentlicht in:Journal of physics. Conference series 2014-01, Vol.557 (1), p.12047-5
Hauptverfasser: Hung, N H, Oguchi, H, Kuwano, H
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description In this report, we investigated conditions to deposit stoichiometric aluminium nitride (AlN) thin films grown on (100)-oriented Si substrates under various Ar/N2 gas flow rates at a wide range of temperature from room temperature (RT) to 350°C using electron cyclotron resonance (ECR) reactive sputtering. This study revealed that stoichiometric of thin film can be controlled by N2/Ar flow rate and that stoichiometric N/Al 1 was archived at N2/Ar 2. This study also revealed that crystallinity can be controlled by substrate temperature. From RT to 200°C, thin films were amorphous or poly-crystal, at 350°C however, thin film was mainly [110] and [100] AlN. Obtained thin films are densely packed and have very low root mean square (RMS) roughness of 0.41 nm which is much less than other sputtering methods.
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subjects Aluminium nitride
Aluminum
Aluminum nitride
Crystallinity
Cyclotron resonance
Electron cyclotron resonance
Film growth
Flow velocity
Gas flow
Physics
Room temperature
Silicon substrates
Sputtering
Thin films
title AlN thin film growth using electron cyclotron resonance reactive sputtering
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