CVD of pure copper films from novel iso-ureate complexes
We report the synthesis and characterisation of a new family of copper(i) metal precursors based around alkoxy-N,N'-di-alkyl-ureate ligands, and their subsequent application in the production of pure copper thin films. The molecular structure of the complexes bis-copper(i)(methoxy-N,N'-di-...
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Veröffentlicht in: | Dalton transactions : an international journal of inorganic chemistry 2013-04, Vol.42 (15), p.5554-5541 |
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container_title | Dalton transactions : an international journal of inorganic chemistry |
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creator | Willcocks, Alexander M Pugh, Thomas Hamilton, Jeff A Johnson, Andrew L Richards, Stephen P Kingsley, Andrew J |
description | We report the synthesis and characterisation of a new family of copper(i) metal precursors based around alkoxy-N,N'-di-alkyl-ureate ligands, and their subsequent application in the production of pure copper thin films. The molecular structure of the complexes bis-copper(i)(methoxy-N,N'-di-isopropylureate) (1) and bis-copper(i)(methoxy-N,N'-di-cyclohexylureate)(5) are described, as determined by single crystal X-ray diffraction analysis. Thermogravimetric analysis of the complexes highlighted complex 1 as a possible copper CVD precursor. Low pressure chemical vapour deposition (LP-CVD) was employed using precursor 1, to synthesise thin films of metallic copper on ruthenium substrates under an atmosphere of hydrogen (H2). Analysis of the thin films deposited at substrate temperatures of 225 °C, 250 °C and 300 °C, respectively, by SEM and AFM reveal the films to be continuous and pin hole free, and show the presence of temperature dependent growth features on the surface of the thin films. Energy dispersive X-ray spectroscopy (EDX), powder X-ray diffraction (PXRD) and X-ray photoelectron spectroscopy (XPS) all show the films to be high purity metallic copper. |
doi_str_mv | 10.1039/c3dt00104k |
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The molecular structure of the complexes bis-copper(i)(methoxy-N,N'-di-isopropylureate) (1) and bis-copper(i)(methoxy-N,N'-di-cyclohexylureate)(5) are described, as determined by single crystal X-ray diffraction analysis. Thermogravimetric analysis of the complexes highlighted complex 1 as a possible copper CVD precursor. Low pressure chemical vapour deposition (LP-CVD) was employed using precursor 1, to synthesise thin films of metallic copper on ruthenium substrates under an atmosphere of hydrogen (H2). Analysis of the thin films deposited at substrate temperatures of 225 °C, 250 °C and 300 °C, respectively, by SEM and AFM reveal the films to be continuous and pin hole free, and show the presence of temperature dependent growth features on the surface of the thin films. Energy dispersive X-ray spectroscopy (EDX), powder X-ray diffraction (PXRD) and X-ray photoelectron spectroscopy (XPS) all show the films to be high purity metallic copper.</description><subject>CHEMICAL VAPOR DEPOSITION</subject><subject>Copper</subject><subject>COPPER (PURE)</subject><subject>DEPOSITION</subject><subject>Diffraction</subject><subject>MOLECULAR STRUCTURE</subject><subject>Precursors</subject><subject>THERMOGRAVIMETRIC ANALYSIS</subject><subject>THIN FILMS</subject><subject>VAPOR DEPOSITION</subject><subject>X RAY SPECTROSCOPY</subject><subject>X RAYS</subject><subject>X-ray photoelectron spectroscopy</subject><issn>1477-9226</issn><issn>1477-9234</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqNkE1LxDAQhoMo7rp68QdIjyJUk5k0aY6y6xcseFGvpR8TqLabmrSi_94uu65HPc0w78ML8zB2Kvil4GiuSqx6zgWXb3tsKqTWsQGU-7sd1IQdhfDKOQBP4JBNxhgSo9WUpfOXReRs1A2eotJ1HfnI1k0bIutdG63cBzVRHVw85nm_RtquoU8Kx-zA5k2gk-2csefbm6f5fbx8vHuYXy_jEhPsY0itNiCEyCtlQRHqQsN4UJCSFChEVRTAVaEwLwtdycImZAmQOIIyKccZO9_0dt69DxT6rK1DSU2Tr8gNIRMax9cRMP0bRWkkolLyH6hIleEmSUb0YoOW3oXgyWadr9vcf2WCZ2v_2a__ET7b9g5FS9UO_RGO38S2fYo</recordid><startdate>20130421</startdate><enddate>20130421</enddate><creator>Willcocks, Alexander M</creator><creator>Pugh, Thomas</creator><creator>Hamilton, Jeff A</creator><creator>Johnson, Andrew L</creator><creator>Richards, Stephen P</creator><creator>Kingsley, Andrew J</creator><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7X8</scope><scope>7U5</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope><scope>L7M</scope><scope>7SR</scope><scope>8BQ</scope></search><sort><creationdate>20130421</creationdate><title>CVD of pure copper films from novel iso-ureate complexes</title><author>Willcocks, Alexander M ; Pugh, Thomas ; Hamilton, Jeff A ; Johnson, Andrew L ; Richards, Stephen P ; Kingsley, Andrew J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c353t-28f792111ad6f26e37b72921628e41311dbb206b63acb7d4bf5efe23e03269803</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CHEMICAL VAPOR DEPOSITION</topic><topic>Copper</topic><topic>COPPER (PURE)</topic><topic>DEPOSITION</topic><topic>Diffraction</topic><topic>MOLECULAR STRUCTURE</topic><topic>Precursors</topic><topic>THERMOGRAVIMETRIC ANALYSIS</topic><topic>THIN FILMS</topic><topic>VAPOR DEPOSITION</topic><topic>X RAY SPECTROSCOPY</topic><topic>X RAYS</topic><topic>X-ray photoelectron spectroscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Willcocks, Alexander M</creatorcontrib><creatorcontrib>Pugh, Thomas</creatorcontrib><creatorcontrib>Hamilton, Jeff A</creatorcontrib><creatorcontrib>Johnson, Andrew L</creatorcontrib><creatorcontrib>Richards, Stephen P</creatorcontrib><creatorcontrib>Kingsley, Andrew J</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>MEDLINE - Academic</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><jtitle>Dalton transactions : an international journal of inorganic chemistry</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Willcocks, Alexander M</au><au>Pugh, Thomas</au><au>Hamilton, Jeff A</au><au>Johnson, Andrew L</au><au>Richards, Stephen P</au><au>Kingsley, Andrew J</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>CVD of pure copper films from novel iso-ureate complexes</atitle><jtitle>Dalton transactions : an international journal of inorganic chemistry</jtitle><addtitle>Dalton Trans</addtitle><date>2013-04-21</date><risdate>2013</risdate><volume>42</volume><issue>15</issue><spage>5554</spage><epage>5541</epage><pages>5554-5541</pages><issn>1477-9226</issn><eissn>1477-9234</eissn><abstract>We report the synthesis and characterisation of a new family of copper(i) metal precursors based around alkoxy-N,N'-di-alkyl-ureate ligands, and their subsequent application in the production of pure copper thin films. The molecular structure of the complexes bis-copper(i)(methoxy-N,N'-di-isopropylureate) (1) and bis-copper(i)(methoxy-N,N'-di-cyclohexylureate)(5) are described, as determined by single crystal X-ray diffraction analysis. Thermogravimetric analysis of the complexes highlighted complex 1 as a possible copper CVD precursor. Low pressure chemical vapour deposition (LP-CVD) was employed using precursor 1, to synthesise thin films of metallic copper on ruthenium substrates under an atmosphere of hydrogen (H2). Analysis of the thin films deposited at substrate temperatures of 225 °C, 250 °C and 300 °C, respectively, by SEM and AFM reveal the films to be continuous and pin hole free, and show the presence of temperature dependent growth features on the surface of the thin films. Energy dispersive X-ray spectroscopy (EDX), powder X-ray diffraction (PXRD) and X-ray photoelectron spectroscopy (XPS) all show the films to be high purity metallic copper.</abstract><cop>England</cop><pmid>23425976</pmid><doi>10.1039/c3dt00104k</doi><tpages>12</tpages></addata></record> |
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source | Royal Society Of Chemistry Journals 2008-; Alma/SFX Local Collection |
subjects | CHEMICAL VAPOR DEPOSITION Copper COPPER (PURE) DEPOSITION Diffraction MOLECULAR STRUCTURE Precursors THERMOGRAVIMETRIC ANALYSIS THIN FILMS VAPOR DEPOSITION X RAY SPECTROSCOPY X RAYS X-ray photoelectron spectroscopy |
title | CVD of pure copper films from novel iso-ureate complexes |
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