A Study on the Conductivity Variation of Au Coated Conductive Particles in ACF Packaging Process

In the ACF packaging process, a bonding force will be applied to the ACF structure. The finite element analysis is used to simulate the ACF packaging process. Material behavior is assumed to be superelastic for resin, viscoelastic for polymer matrix, and elastic-plastic for metal, such as bump, pad,...

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Veröffentlicht in:	Journal of nanomaterials 2015-01, Vol.2015 (2015), p.1-8
Hauptverfasser:	Kuang, Jao-Hwa, Lin, Ah-Der, Hsu, Chao-Ming
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesives Atoms & subatomic particles Bonding Computer simulation Conductivity Contact Curing Deformation Epoxy resins Finite element method Mathematical models Mechanical engineering Nanomaterials Operating temperature Packaging Residual stress Thin films
Online-Zugang:	Volltext
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