Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment

•We demonstrate a novel Pb-free die-attachment structure using Sn-plated Zn solder.•The bonded microstructure can be controlled by the process time.•The current bonding structure shows high bonding strength above 30MP.•The fracture of current bonding system occurred in the β-Sn matrix soldered layer...

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