Electroless deposition of Au, Pt, or Ru metallic layers on CdZnTe
The electrical and structural properties of thin metallic layers (Au, Pt, or Ru) on CdZnTe (CZT) deposited by electroless deposition method have been investigated by means of atomic force microscopy (AFM), scanning electron microscopy (SEM), and Rutherford backscattering spectroscopy (RBS) measureme...
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| Veröffentlicht in: | Thin solid films 2012-12, Vol.525, p.56-63 |
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| creator | Zheng, Q. Dierre, F. Corregidor, V. Crocco, J. Bensalah, H. Plaza, J.L. Alves, E. Dieguez, E. |
| description | The electrical and structural properties of thin metallic layers (Au, Pt, or Ru) on CdZnTe (CZT) deposited by electroless deposition method have been investigated by means of atomic force microscopy (AFM), scanning electron microscopy (SEM), and Rutherford backscattering spectroscopy (RBS) measurements. SEM and AFM techniques put in evidence the modification of the morphology and the contact's roughness dependence with the deposition time. The surface of the Pt or Ru layer on a CZT material presents micro-cracks at a critical thickness, whereas it does not occur with the Au layer. The thickness of the Au layer with different deposition times obtained by RBS indicates first a fast increase in thickness for short deposition times and then saturation to an asymptotic value of 120nm after 1h.
► Modification of morphology and roughness depending on the time of deposition. ► Appearance of cracks for Pt and Ru layers after a certain critical thickness. ► Rapid initial increase in thickness for the Au layer and then saturation at 120nm. ► Due to the layers' porosity, the thickness of TeO2 increases with deposition time. ► Pt is a polycrystalline layer but Ru is deposited epitaxially on CdZnTe. |
| doi_str_mv | 10.1016/j.tsf.2012.09.058 |
| format | Article |
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► Modification of morphology and roughness depending on the time of deposition. ► Appearance of cracks for Pt and Ru layers after a certain critical thickness. ► Rapid initial increase in thickness for the Au layer and then saturation at 120nm. ► Due to the layers' porosity, the thickness of TeO2 increases with deposition time. ► Pt is a polycrystalline layer but Ru is deposited epitaxially on CdZnTe.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/j.tsf.2012.09.058</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Atomic force microscopy ; Cadmium zinc telluride ; Cadmium zinc tellurides ; Critical thickness ; Cross-disciplinary physics: materials science; rheology ; Deposition ; Electrodeposition, electroplating ; Electroless deposition ; Exact sciences and technology ; Gold ; Materials science ; Metal films ; Methods of deposition of films and coatings; film growth and epitaxy ; Micro-cracks ; Morphology ; Physics ; Platinum ; Scanning electron microscopy ; Thin films</subject><ispartof>Thin solid films, 2012-12, Vol.525, p.56-63</ispartof><rights>2012 Elsevier B.V.</rights><rights>2014 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c459t-18a35878e187d79f839ffa34028dac2504a30423c101ab2c543503d34353b0f33</citedby><cites>FETCH-LOGICAL-c459t-18a35878e187d79f839ffa34028dac2504a30423c101ab2c543503d34353b0f33</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0040609012011984$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27901,27902,65534</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=27101036$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Zheng, Q.</creatorcontrib><creatorcontrib>Dierre, F.</creatorcontrib><creatorcontrib>Corregidor, V.</creatorcontrib><creatorcontrib>Crocco, J.</creatorcontrib><creatorcontrib>Bensalah, H.</creatorcontrib><creatorcontrib>Plaza, J.L.</creatorcontrib><creatorcontrib>Alves, E.</creatorcontrib><creatorcontrib>Dieguez, E.</creatorcontrib><title>Electroless deposition of Au, Pt, or Ru metallic layers on CdZnTe</title><title>Thin solid films</title><description>The electrical and structural properties of thin metallic layers (Au, Pt, or Ru) on CdZnTe (CZT) deposited by electroless deposition method have been investigated by means of atomic force microscopy (AFM), scanning electron microscopy (SEM), and Rutherford backscattering spectroscopy (RBS) measurements. SEM and AFM techniques put in evidence the modification of the morphology and the contact's roughness dependence with the deposition time. The surface of the Pt or Ru layer on a CZT material presents micro-cracks at a critical thickness, whereas it does not occur with the Au layer. The thickness of the Au layer with different deposition times obtained by RBS indicates first a fast increase in thickness for short deposition times and then saturation to an asymptotic value of 120nm after 1h.
► Modification of morphology and roughness depending on the time of deposition. ► Appearance of cracks for Pt and Ru layers after a certain critical thickness. ► Rapid initial increase in thickness for the Au layer and then saturation at 120nm. ► Due to the layers' porosity, the thickness of TeO2 increases with deposition time. ► Pt is a polycrystalline layer but Ru is deposited epitaxially on CdZnTe.</description><subject>Atomic force microscopy</subject><subject>Cadmium zinc telluride</subject><subject>Cadmium zinc tellurides</subject><subject>Critical thickness</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Deposition</subject><subject>Electrodeposition, electroplating</subject><subject>Electroless deposition</subject><subject>Exact sciences and technology</subject><subject>Gold</subject><subject>Materials science</subject><subject>Metal films</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Micro-cracks</subject><subject>Morphology</subject><subject>Physics</subject><subject>Platinum</subject><subject>Scanning electron microscopy</subject><subject>Thin films</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LAzEQhoMoWKs_wFsugofuOvnY7gZPpdQPKChSL15Cmk0gJd3UZFfovzel4lFPc3ned2YehK4JlATI9G5T9smWFAgtQZRQNSdoRJpaFLRm5BSNADgUUxBwji5S2gBkkrIRmi280X0M3qSEW7MLyfUudDhYPBsm-LWf4BDx24C3plfeO4292puYcGbm7Ue3MpfozCqfzNXPHKP3h8Vq_lQsXx6f57NloXkl-oI0ilVN3Zh8VVsL2zBhrWIcaNMqTSvgigGnTOd31JrqirMKWMvyYGuwjI3R7bF3F8PnYFIvty5p473qTBiSJDUQEIKB-B9lXHDaEEIzSo6ojiGlaKzcRbdVcS8JyINZuZHZrDyYlSBkNpszNz_1KmnlbVSdduk3SOucAzbN3P2RM1nLlzNRJu1Mp03rYpYu2-D-2PINKciKZg</recordid><startdate>20121215</startdate><enddate>20121215</enddate><creator>Zheng, Q.</creator><creator>Dierre, F.</creator><creator>Corregidor, V.</creator><creator>Crocco, J.</creator><creator>Bensalah, H.</creator><creator>Plaza, J.L.</creator><creator>Alves, E.</creator><creator>Dieguez, E.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20121215</creationdate><title>Electroless deposition of Au, Pt, or Ru metallic layers on CdZnTe</title><author>Zheng, Q. ; Dierre, F. ; Corregidor, V. ; Crocco, J. ; Bensalah, H. ; Plaza, J.L. ; Alves, E. ; Dieguez, E.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c459t-18a35878e187d79f839ffa34028dac2504a30423c101ab2c543503d34353b0f33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Atomic force microscopy</topic><topic>Cadmium zinc telluride</topic><topic>Cadmium zinc tellurides</topic><topic>Critical thickness</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Deposition</topic><topic>Electrodeposition, electroplating</topic><topic>Electroless deposition</topic><topic>Exact sciences and technology</topic><topic>Gold</topic><topic>Materials science</topic><topic>Metal films</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Micro-cracks</topic><topic>Morphology</topic><topic>Physics</topic><topic>Platinum</topic><topic>Scanning electron microscopy</topic><topic>Thin films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zheng, Q.</creatorcontrib><creatorcontrib>Dierre, F.</creatorcontrib><creatorcontrib>Corregidor, V.</creatorcontrib><creatorcontrib>Crocco, J.</creatorcontrib><creatorcontrib>Bensalah, H.</creatorcontrib><creatorcontrib>Plaza, J.L.</creatorcontrib><creatorcontrib>Alves, E.</creatorcontrib><creatorcontrib>Dieguez, E.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zheng, Q.</au><au>Dierre, F.</au><au>Corregidor, V.</au><au>Crocco, J.</au><au>Bensalah, H.</au><au>Plaza, J.L.</au><au>Alves, E.</au><au>Dieguez, E.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electroless deposition of Au, Pt, or Ru metallic layers on CdZnTe</atitle><jtitle>Thin solid films</jtitle><date>2012-12-15</date><risdate>2012</risdate><volume>525</volume><spage>56</spage><epage>63</epage><pages>56-63</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>The electrical and structural properties of thin metallic layers (Au, Pt, or Ru) on CdZnTe (CZT) deposited by electroless deposition method have been investigated by means of atomic force microscopy (AFM), scanning electron microscopy (SEM), and Rutherford backscattering spectroscopy (RBS) measurements. SEM and AFM techniques put in evidence the modification of the morphology and the contact's roughness dependence with the deposition time. The surface of the Pt or Ru layer on a CZT material presents micro-cracks at a critical thickness, whereas it does not occur with the Au layer. The thickness of the Au layer with different deposition times obtained by RBS indicates first a fast increase in thickness for short deposition times and then saturation to an asymptotic value of 120nm after 1h.
► Modification of morphology and roughness depending on the time of deposition. ► Appearance of cracks for Pt and Ru layers after a certain critical thickness. ► Rapid initial increase in thickness for the Au layer and then saturation at 120nm. ► Due to the layers' porosity, the thickness of TeO2 increases with deposition time. ► Pt is a polycrystalline layer but Ru is deposited epitaxially on CdZnTe.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.tsf.2012.09.058</doi><tpages>8</tpages></addata></record> |
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| subjects | Atomic force microscopy Cadmium zinc telluride Cadmium zinc tellurides Critical thickness Cross-disciplinary physics: materials science rheology Deposition Electrodeposition, electroplating Electroless deposition Exact sciences and technology Gold Materials science Metal films Methods of deposition of films and coatings film growth and epitaxy Micro-cracks Morphology Physics Platinum Scanning electron microscopy Thin films |
| title | Electroless deposition of Au, Pt, or Ru metallic layers on CdZnTe |
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