Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition
A perfect match: Silver deposition is one of the fastest electrochemical reactions, even though the Ag+ ion loses more than 5 eV solvation energy in the process. This phenomenon, an example of the enigma of metal deposition, was investigated by a combination of MD simulations, DFT, and specially dev...
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Veröffentlicht in: | Angewandte Chemie International Edition 2013-07, Vol.52 (30), p.7883-7885 |
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description | A perfect match: Silver deposition is one of the fastest electrochemical reactions, even though the Ag+ ion loses more than 5 eV solvation energy in the process. This phenomenon, an example of the enigma of metal deposition, was investigated by a combination of MD simulations, DFT, and specially developed theory. At the surface, the Ag+ ion experiences a strong interaction with the sp band of silver, which catalyzes the reaction. |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1701044518</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3021209721</sourcerecordid><originalsourceid>FETCH-LOGICAL-c5508-f962ce77cb23e65f83fb4ac11759e5aa6907c131feb18f35814e3eace36c4abb3</originalsourceid><addsrcrecordid>eNqFkUFPGzEQRi0EAkq59lhZ4tLLBs_aXnt7Q0lIgihtBRVHy-vOgulmna43lPx7HAUi1Asnj6z3PWnmI-QTsAEwlp_a1uMgZ8AZlKXeIYcgc8i4Unw3zYLzTGkJB-RDjA-J15oV--Qg50qn7_yQTG_vV_TaN4_Y0REuQvS9Dy31kcZAz23sv9Lr0Dz69o7290jHrb-bWxpq-g1727yJfCR7tW0iHr-8R-TX-fhmOM0uv09mw7PLzEnJdFaXRe5QKVflHAtZa15XwjoAJUuU1hYlUw441FiBrrnUIJCjdcgLJ2xV8SPyZeNddOHvEmNv5j46bBrbYlhGA4oBE0KCfh8VrAAlSs0SevIf-hCWXZsWWVPJp3heJGqwoVwXYuywNovOz223MsDMug6zrsNs60iBzy_aZTXH31v89f4JKDfAP9_g6h2dObuajd_Ks03Wxx6ftlnb_TGF4kqa26uJGQk5_aF_jswFfwabAqOl</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1400447326</pqid></control><display><type>article</type><title>Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition</title><source>Access via Wiley Online Library</source><creator>Pinto, Leandro M. C. ; Spohr, Eckhard ; Quaino, Paola ; Santos, Elizabeth ; Schmickler, Wolfgang</creator><creatorcontrib>Pinto, Leandro M. C. ; Spohr, Eckhard ; Quaino, Paola ; Santos, Elizabeth ; Schmickler, Wolfgang</creatorcontrib><description>A perfect match: Silver deposition is one of the fastest electrochemical reactions, even though the Ag+ ion loses more than 5 eV solvation energy in the process. This phenomenon, an example of the enigma of metal deposition, was investigated by a combination of MD simulations, DFT, and specially developed theory. At the surface, the Ag+ ion experiences a strong interaction with the sp band of silver, which catalyzes the reaction.</description><edition>International ed. in English</edition><identifier>ISSN: 1433-7851</identifier><identifier>EISSN: 1521-3773</identifier><identifier>DOI: 10.1002/anie.201301998</identifier><identifier>PMID: 23788512</identifier><identifier>CODEN: ACIEAY</identifier><language>eng</language><publisher>Weinheim: WILEY-VCH Verlag</publisher><subject>corrosion ; Deposition ; metal deposition ; Silver ; Simulation ; Solvation ; theoretical electrochemistry</subject><ispartof>Angewandte Chemie International Edition, 2013-07, Vol.52 (30), p.7883-7885</ispartof><rights>Copyright © 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim</rights><rights>Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.</rights><rights>Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c5508-f962ce77cb23e65f83fb4ac11759e5aa6907c131feb18f35814e3eace36c4abb3</citedby><cites>FETCH-LOGICAL-c5508-f962ce77cb23e65f83fb4ac11759e5aa6907c131feb18f35814e3eace36c4abb3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fanie.201301998$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fanie.201301998$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1417,27924,27925,45574,45575</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/23788512$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Pinto, Leandro M. C.</creatorcontrib><creatorcontrib>Spohr, Eckhard</creatorcontrib><creatorcontrib>Quaino, Paola</creatorcontrib><creatorcontrib>Santos, Elizabeth</creatorcontrib><creatorcontrib>Schmickler, Wolfgang</creatorcontrib><title>Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition</title><title>Angewandte Chemie International Edition</title><addtitle>Angew. Chem. Int. Ed</addtitle><description>A perfect match: Silver deposition is one of the fastest electrochemical reactions, even though the Ag+ ion loses more than 5 eV solvation energy in the process. This phenomenon, an example of the enigma of metal deposition, was investigated by a combination of MD simulations, DFT, and specially developed theory. At the surface, the Ag+ ion experiences a strong interaction with the sp band of silver, which catalyzes the reaction.</description><subject>corrosion</subject><subject>Deposition</subject><subject>metal deposition</subject><subject>Silver</subject><subject>Simulation</subject><subject>Solvation</subject><subject>theoretical electrochemistry</subject><issn>1433-7851</issn><issn>1521-3773</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqFkUFPGzEQRi0EAkq59lhZ4tLLBs_aXnt7Q0lIgihtBRVHy-vOgulmna43lPx7HAUi1Asnj6z3PWnmI-QTsAEwlp_a1uMgZ8AZlKXeIYcgc8i4Unw3zYLzTGkJB-RDjA-J15oV--Qg50qn7_yQTG_vV_TaN4_Y0REuQvS9Dy31kcZAz23sv9Lr0Dz69o7290jHrb-bWxpq-g1727yJfCR7tW0iHr-8R-TX-fhmOM0uv09mw7PLzEnJdFaXRe5QKVflHAtZa15XwjoAJUuU1hYlUw441FiBrrnUIJCjdcgLJ2xV8SPyZeNddOHvEmNv5j46bBrbYlhGA4oBE0KCfh8VrAAlSs0SevIf-hCWXZsWWVPJp3heJGqwoVwXYuywNovOz223MsDMug6zrsNs60iBzy_aZTXH31v89f4JKDfAP9_g6h2dObuajd_Ks03Wxx6ftlnb_TGF4kqa26uJGQk5_aF_jswFfwabAqOl</recordid><startdate>20130722</startdate><enddate>20130722</enddate><creator>Pinto, Leandro M. C.</creator><creator>Spohr, Eckhard</creator><creator>Quaino, Paola</creator><creator>Santos, Elizabeth</creator><creator>Schmickler, Wolfgang</creator><general>WILEY-VCH Verlag</general><general>WILEY‐VCH Verlag</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7TM</scope><scope>K9.</scope><scope>7X8</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20130722</creationdate><title>Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition</title><author>Pinto, Leandro M. C. ; Spohr, Eckhard ; Quaino, Paola ; Santos, Elizabeth ; Schmickler, Wolfgang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c5508-f962ce77cb23e65f83fb4ac11759e5aa6907c131feb18f35814e3eace36c4abb3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>corrosion</topic><topic>Deposition</topic><topic>metal deposition</topic><topic>Silver</topic><topic>Simulation</topic><topic>Solvation</topic><topic>theoretical electrochemistry</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Pinto, Leandro M. C.</creatorcontrib><creatorcontrib>Spohr, Eckhard</creatorcontrib><creatorcontrib>Quaino, Paola</creatorcontrib><creatorcontrib>Santos, Elizabeth</creatorcontrib><creatorcontrib>Schmickler, Wolfgang</creatorcontrib><collection>Istex</collection><collection>PubMed</collection><collection>CrossRef</collection><collection>Nucleic Acids Abstracts</collection><collection>ProQuest Health & Medical Complete (Alumni)</collection><collection>MEDLINE - Academic</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Angewandte Chemie International Edition</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Pinto, Leandro M. C.</au><au>Spohr, Eckhard</au><au>Quaino, Paola</au><au>Santos, Elizabeth</au><au>Schmickler, Wolfgang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition</atitle><jtitle>Angewandte Chemie International Edition</jtitle><addtitle>Angew. Chem. Int. Ed</addtitle><date>2013-07-22</date><risdate>2013</risdate><volume>52</volume><issue>30</issue><spage>7883</spage><epage>7885</epage><pages>7883-7885</pages><issn>1433-7851</issn><eissn>1521-3773</eissn><coden>ACIEAY</coden><abstract>A perfect match: Silver deposition is one of the fastest electrochemical reactions, even though the Ag+ ion loses more than 5 eV solvation energy in the process. This phenomenon, an example of the enigma of metal deposition, was investigated by a combination of MD simulations, DFT, and specially developed theory. At the surface, the Ag+ ion experiences a strong interaction with the sp band of silver, which catalyzes the reaction.</abstract><cop>Weinheim</cop><pub>WILEY-VCH Verlag</pub><pmid>23788512</pmid><doi>10.1002/anie.201301998</doi><tpages>3</tpages><edition>International ed. in English</edition><oa>free_for_read</oa></addata></record> |
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subjects | corrosion Deposition metal deposition Silver Simulation Solvation theoretical electrochemistry |
title | Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition |
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