Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates

► The interfacial reactions of Sn, Sn–3.0wt% Ag–0.5wt% Cu (SAC), Sn–0.7wt% Cu (SC), Sn–58wt% Bi (SB) and Sn–9wt% Zn (SZ) lead-free solders with the Au/Pd/Ni/brass multilayer substrate were first systematically investigated in this study. ► The Cu–Zn phase was formed at the interface, and it can act...

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Veröffentlicht in:	Journal of alloys and compounds 2012-03, Vol.517, p.111-117
Hauptverfasser:	Yen, Yee-wen, Tsai, Po-hao, Fang, Yang-kai, Chen, Bo-jyun, Lee, Chiapyng
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Au/Pd/Ni/brass multilayer substrate Brasses Brazing. Soldering Copper Exact sciences and technology Gold Interface reactions Interfacial reaction Intermetallic compound Joining, thermal cutting: metallurgical aspects Lead-free solder Metals. Metallurgy Nickel Palladium Phases Tin
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