Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

A review is provided, which first considers low-temperature diffusion bonding with silver nanomaterials as filler materials via thermal sintering for microelectronic applications, and then other recent innovations in low-temperature joining are discussed. The theoretical background and transition of...

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Veröffentlicht in:	ACS applied materials & interfaces 2015-06, Vol.7 (23), p.12597-12618
Hauptverfasser:	Peng, Peng, Hu, Anming, Gerlich, Adrian P, Zou, Guisheng, Liu, Lei, Zhou, Y. Norman
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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