Temperature Dependence of Resistance of Conductive Filament Formed by Dielectric Breakdown

An investigation of current--voltage ($I$--$V$) characteristics and the temperature dependence of resistance in a resistive switching (RS) memory with a Cu/SiO 2 /Au device was performed. Moreover, conductive spots were observed by scanning electron microscopy (SEM) and cross-sectional transmission...

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Veröffentlicht in:Japanese Journal of Applied Physics 2013-06, Vol.52 (6), p.06GF04-06GF04-5
Hauptverfasser: Otsuka, Shintaro, Kato, Takashi, Kyomi, Takuya, Hamada, Yoshifumi, Tada, Yoshihiro, Shimizu, Tomohiro, Shingubara, Shoso
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container_end_page 06GF04-5
container_issue 6
container_start_page 06GF04
container_title Japanese Journal of Applied Physics
container_volume 52
creator Otsuka, Shintaro
Kato, Takashi
Kyomi, Takuya
Hamada, Yoshifumi
Tada, Yoshihiro
Shimizu, Tomohiro
Shingubara, Shoso
description An investigation of current--voltage ($I$--$V$) characteristics and the temperature dependence of resistance in a resistive switching (RS) memory with a Cu/SiO 2 /Au device was performed. Moreover, conductive spots were observed by scanning electron microscopy (SEM) and cross-sectional transmission electron microscopy (TEM). Both unipolar and bipolar operation modes were obtained. From the temperature dependence of resistance, it is suggested that the conduction mechanism of the low resistance state (LRS) is metallic conduction and that of the high resistance state (HRS) is variable-range hopping (VRH) conduction. The results of observing the device support this suggestion. We propose the switching mechanism in the Cu/SiO 2 /Au device from these results.
doi_str_mv 10.7567/JJAP.52.06GF04
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subjects Conduction heating
Copper
Devices
Gold
Scanning electron microscopy
Silicon dioxide
Switching
Temperature dependence
title Temperature Dependence of Resistance of Conductive Filament Formed by Dielectric Breakdown
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