Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects
Low-resistance metal contacts for CVD-nanocarbon (NC)/cobalt (Co) interconnects have been investigated among contact metals such as Ni, Ti, Au, and Cu. Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superio...
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Veröffentlicht in: | Japanese Journal of Applied Physics 2013-05, Vol.52 (5), p.05FD01-05FD01-4 |
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container_issue | 5 |
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container_title | Japanese Journal of Applied Physics |
container_volume | 52 |
creator | Ueno, Kazuyoshi Takagi, Masashi Yano, Hiroaki Wakui, Taichi Yamazaki, Yuichi Sakuma, Naoshi Kajita, Akihiro Sakai, Tadashi |
description | Low-resistance metal contacts for CVD-nanocarbon (NC)/cobalt (Co) interconnects have been investigated among contact metals such as Ni, Ti, Au, and Cu. Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superior adhesion were obtained from Ni. Although the factors for the low contact resistivity were not clear enough from the comparison of work-function difference and adhesion strength for the contact metals, Ni is a promising low-resistivity contact metal for CVD-NC interconnects in the future. |
doi_str_mv | 10.7567/JJAP.52.05FD01 |
format | Article |
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Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superior adhesion were obtained from Ni. Although the factors for the low contact resistivity were not clear enough from the comparison of work-function difference and adhesion strength for the contact metals, Ni is a promising low-resistivity contact metal for CVD-NC interconnects in the future.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.7567/JJAP.52.05FD01</identifier><language>eng</language><publisher>The Japan Society of Applied Physics</publisher><subject>Adhesive strength ; Cobalt ; Copper ; Electrical resistivity ; Gold ; Interconnections ; Nanostructure ; Nickel</subject><ispartof>Japanese Journal of Applied Physics, 2013-05, Vol.52 (5), p.05FD01-05FD01-4</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c400t-6b718535cf10ea8dcb6448878325d0c98e51dfda06c8301fa06784dd4cc9f76c3</citedby><cites>FETCH-LOGICAL-c400t-6b718535cf10ea8dcb6448878325d0c98e51dfda06c8301fa06784dd4cc9f76c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>Ueno, Kazuyoshi</creatorcontrib><creatorcontrib>Takagi, Masashi</creatorcontrib><creatorcontrib>Yano, Hiroaki</creatorcontrib><creatorcontrib>Wakui, Taichi</creatorcontrib><creatorcontrib>Yamazaki, Yuichi</creatorcontrib><creatorcontrib>Sakuma, Naoshi</creatorcontrib><creatorcontrib>Kajita, Akihiro</creatorcontrib><creatorcontrib>Sakai, Tadashi</creatorcontrib><title>Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects</title><title>Japanese Journal of Applied Physics</title><description>Low-resistance metal contacts for CVD-nanocarbon (NC)/cobalt (Co) interconnects have been investigated among contact metals such as Ni, Ti, Au, and Cu. Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superior adhesion were obtained from Ni. Although the factors for the low contact resistivity were not clear enough from the comparison of work-function difference and adhesion strength for the contact metals, Ni is a promising low-resistivity contact metal for CVD-NC interconnects in the future.</description><subject>Adhesive strength</subject><subject>Cobalt</subject><subject>Copper</subject><subject>Electrical resistivity</subject><subject>Gold</subject><subject>Interconnections</subject><subject>Nanostructure</subject><subject>Nickel</subject><issn>0021-4922</issn><issn>1347-4065</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNp1kM9LwzAUx4MoOKdXz8WTCO2SNkmz46hON-YPRM8hfU2g0iU1yRD_ezsqXlR48N6Dz_d7-CB0TnBWMl7O1uvFU8byDLPlNSYHaEIKWqYUc3aIJhjnJKXzPD9GJyG8DS9nlEzQYuM-0mcd2hCVBZ3c66i6pHI2KoghMc4nD8o6UL52dla5WnUxWdmoPThr9cCcoiOjuqDPvvcUvS5vXqq7dPN4u6oWmxQoxjHldUkEKxgYgrUSDdScUiFKUeSswTAXmpHGNApzEAUmZjhKQZuGAsxNyaGYosuxt_fufadDlNs2gO46ZbXbBUm4YIKIYQY0G1HwLgSvjex9u1X-UxIs967k3pVkuRxdDYGLMdD2qv-Bf0FXf0D_NH4Bahd0PQ</recordid><startdate>20130501</startdate><enddate>20130501</enddate><creator>Ueno, Kazuyoshi</creator><creator>Takagi, Masashi</creator><creator>Yano, Hiroaki</creator><creator>Wakui, Taichi</creator><creator>Yamazaki, Yuichi</creator><creator>Sakuma, Naoshi</creator><creator>Kajita, Akihiro</creator><creator>Sakai, Tadashi</creator><general>The Japan Society of Applied Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20130501</creationdate><title>Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects</title><author>Ueno, Kazuyoshi ; Takagi, Masashi ; Yano, Hiroaki ; Wakui, Taichi ; Yamazaki, Yuichi ; Sakuma, Naoshi ; Kajita, Akihiro ; Sakai, Tadashi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c400t-6b718535cf10ea8dcb6448878325d0c98e51dfda06c8301fa06784dd4cc9f76c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Adhesive strength</topic><topic>Cobalt</topic><topic>Copper</topic><topic>Electrical resistivity</topic><topic>Gold</topic><topic>Interconnections</topic><topic>Nanostructure</topic><topic>Nickel</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ueno, Kazuyoshi</creatorcontrib><creatorcontrib>Takagi, Masashi</creatorcontrib><creatorcontrib>Yano, Hiroaki</creatorcontrib><creatorcontrib>Wakui, Taichi</creatorcontrib><creatorcontrib>Yamazaki, Yuichi</creatorcontrib><creatorcontrib>Sakuma, Naoshi</creatorcontrib><creatorcontrib>Kajita, Akihiro</creatorcontrib><creatorcontrib>Sakai, Tadashi</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Japanese Journal of Applied Physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ueno, Kazuyoshi</au><au>Takagi, Masashi</au><au>Yano, Hiroaki</au><au>Wakui, Taichi</au><au>Yamazaki, Yuichi</au><au>Sakuma, Naoshi</au><au>Kajita, Akihiro</au><au>Sakai, Tadashi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects</atitle><jtitle>Japanese Journal of Applied Physics</jtitle><date>2013-05-01</date><risdate>2013</risdate><volume>52</volume><issue>5</issue><spage>05FD01</spage><epage>05FD01-4</epage><pages>05FD01-05FD01-4</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><abstract>Low-resistance metal contacts for CVD-nanocarbon (NC)/cobalt (Co) interconnects have been investigated among contact metals such as Ni, Ti, Au, and Cu. Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superior adhesion were obtained from Ni. Although the factors for the low contact resistivity were not clear enough from the comparison of work-function difference and adhesion strength for the contact metals, Ni is a promising low-resistivity contact metal for CVD-NC interconnects in the future.</abstract><pub>The Japan Society of Applied Physics</pub><doi>10.7567/JJAP.52.05FD01</doi></addata></record> |
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source | IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link |
subjects | Adhesive strength Cobalt Copper Electrical resistivity Gold Interconnections Nanostructure Nickel |
title | Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects |
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