Expeditious low-temperature sintering of copper nanoparticles with thin defective carbon shells

The realization of air-stable nanoparticles, well-formulated nanoinks, and conductive patterns based on copper is a great challenge in low-cost and large-area flexible printed electronics. This work reports the synthesis of a conductively interconnected copper structure via thermal sintering of copp...

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Veröffentlicht in:	Nanoscale 2015-04, Vol.7 (15), p.6627-6635
Hauptverfasser:	Kim, Changkyu, Lee, Gyoungja, Rhee, Changkyu, Lee, Minku
Format:	Artikel
Sprache:	eng
Schlagworte:	Carbon CONNECTORS (ELECTRICAL) Copper DEFECTS ELECTRONIC PRODUCTS Electronics FLEXIBLE PRINTED CIRCUITS Inks MICROSTRUCTURES Nanoparticles Nanostructure Oxidation PARTICLES SINTERING
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