Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim

We newly introduce a compliant rim to realize hermetic sealing of electronic components at low temperature. The compliant rim easily deforms under pressing load owing to its cone-shaped cross section and, therefore, intermetallic bonding can be performed at low temperature. We demonstrate the room-t...

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Veröffentlicht in:	Japanese Journal of Applied Physics 2014-06, Vol.53 (6S), p.6-1-06JM05-4
Hauptverfasser:	Takigawa, Ryo, Iwanabe, Keiichiro, Shuto, Takanori, Takao, Takayuki, Asano, Tanemasa
Format:	Artikel
Sprache:	eng
Schlagworte:	Amplitudes Bonding Cross sections (physics) Gold Hermetic sealing Packaging Pressing Sealing Silicon
Online-Zugang:	Volltext
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