Analytical model for silicon-on-insulator lateral high-voltage devices using variation of lateral thickness technique
Recently, the variation of lateral thickness (VLT) technique has been proposed as an effective lateral voltage-sustaining technology. However, no analytical model has been reported for exploring the physical mechanism quantitatively. By solving the two-dimensional (2D) Poisson equation, an analytica...
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Veröffentlicht in: | Japanese Journal of Applied Physics 2015-02, Vol.54 (2), p.24301-1-024301-6 |
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container_title | Japanese Journal of Applied Physics |
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creator | Yao, Jiafei Guo, Yufeng Li, Man Huang, Xiaofeng Lin, Hong Ji, Xincun Xu, Yue |
description | Recently, the variation of lateral thickness (VLT) technique has been proposed as an effective lateral voltage-sustaining technology. However, no analytical model has been reported for exploring the physical mechanism quantitatively. By solving the two-dimensional (2D) Poisson equation, an analytical model for a silicon-on-insulator (SOI) device with a VLT structure is proposed in this paper to optimize the surface potential and electric field distribution of the VLT SOI device. The lateral and vertical breakdown voltages are formulized to quantify the breakdown characteristic. The drift doping concentration range is derived to maximize the breakdown voltage. This model is used to investigate the electric field distribution and breakdown voltage of the VLT SOI device with various parameters. The validity of the proposed model is verified by the fair agreement between the analytical and numerical results. |
doi_str_mv | 10.7567/JJAP.54.024301 |
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However, no analytical model has been reported for exploring the physical mechanism quantitatively. By solving the two-dimensional (2D) Poisson equation, an analytical model for a silicon-on-insulator (SOI) device with a VLT structure is proposed in this paper to optimize the surface potential and electric field distribution of the VLT SOI device. The lateral and vertical breakdown voltages are formulized to quantify the breakdown characteristic. The drift doping concentration range is derived to maximize the breakdown voltage. This model is used to investigate the electric field distribution and breakdown voltage of the VLT SOI device with various parameters. The validity of the proposed model is verified by the fair agreement between the analytical and numerical results.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.7567/JJAP.54.024301</identifier><identifier>CODEN: JJAPB6</identifier><language>eng</language><publisher>The Japan Society of Applied Physics</publisher><subject>Breakdown ; Devices ; Electric fields ; Electric potential ; Mathematical analysis ; Mathematical models ; Poisson equation ; Two dimensional ; Voltage</subject><ispartof>Japanese Journal of Applied Physics, 2015-02, Vol.54 (2), p.24301-1-024301-6</ispartof><rights>2015 The Japan Society of Applied Physics</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c406t-80c71cf83ca43d418db8e5a8fa97c360f1bcd8273cebd1cbb3fee1fea1dbb8423</citedby><cites>FETCH-LOGICAL-c406t-80c71cf83ca43d418db8e5a8fa97c360f1bcd8273cebd1cbb3fee1fea1dbb8423</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://iopscience.iop.org/article/10.7567/JJAP.54.024301/pdf$$EPDF$$P50$$Giop$$H</linktopdf><link.rule.ids>314,780,784,27924,27925,53846,53893</link.rule.ids></links><search><creatorcontrib>Yao, Jiafei</creatorcontrib><creatorcontrib>Guo, Yufeng</creatorcontrib><creatorcontrib>Li, Man</creatorcontrib><creatorcontrib>Huang, Xiaofeng</creatorcontrib><creatorcontrib>Lin, Hong</creatorcontrib><creatorcontrib>Ji, Xincun</creatorcontrib><creatorcontrib>Xu, Yue</creatorcontrib><title>Analytical model for silicon-on-insulator lateral high-voltage devices using variation of lateral thickness technique</title><title>Japanese Journal of Applied Physics</title><addtitle>Jpn. J. Appl. Phys</addtitle><description>Recently, the variation of lateral thickness (VLT) technique has been proposed as an effective lateral voltage-sustaining technology. However, no analytical model has been reported for exploring the physical mechanism quantitatively. By solving the two-dimensional (2D) Poisson equation, an analytical model for a silicon-on-insulator (SOI) device with a VLT structure is proposed in this paper to optimize the surface potential and electric field distribution of the VLT SOI device. The lateral and vertical breakdown voltages are formulized to quantify the breakdown characteristic. The drift doping concentration range is derived to maximize the breakdown voltage. This model is used to investigate the electric field distribution and breakdown voltage of the VLT SOI device with various parameters. The validity of the proposed model is verified by the fair agreement between the analytical and numerical results.</description><subject>Breakdown</subject><subject>Devices</subject><subject>Electric fields</subject><subject>Electric potential</subject><subject>Mathematical analysis</subject><subject>Mathematical models</subject><subject>Poisson equation</subject><subject>Two dimensional</subject><subject>Voltage</subject><issn>0021-4922</issn><issn>1347-4065</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNp1kM9LwzAUx4MoOKdXzz2K0Jo0aZsdx_AnAz3oOaTpy5qZNTVpB_vvzdjQi8LjPRI-fN_jg9A1wVlVlNXdy8v8LStYhnNGMTlBE0JZlTJcFqdognFOUjbL83N0EcI6PsuCkQka5520u8EoaZONa8Am2vkkGGuU69JYpgujlUP8jB18xFqzatOts4NcQdLA1igIyRhMt0q20hs5GNclTv_wQ2vUZwchJAOotjNfI1yiMy1tgKvjnKKPh_v3xVO6fH18XsyXqYpnDynHqiJKc6okow0jvKk5FJJrOasULbEmtWp4XlEFdUNUXVMNQDRI0tQ1ZzmdoptDbu9dXBsGsTFBgbWyAzcGQUpeVCVnMx7R7IAq70LwoEXvzUb6nSBY7P2KvV9RMHHw-5ttXC_WbvRRZBDrtez3UH7ERN_oiN7-gf6T-w2pdYx-</recordid><startdate>20150201</startdate><enddate>20150201</enddate><creator>Yao, Jiafei</creator><creator>Guo, Yufeng</creator><creator>Li, Man</creator><creator>Huang, Xiaofeng</creator><creator>Lin, Hong</creator><creator>Ji, Xincun</creator><creator>Xu, Yue</creator><general>The Japan Society of Applied Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7TB</scope><scope>7U5</scope><scope>8FD</scope><scope>FR3</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20150201</creationdate><title>Analytical model for silicon-on-insulator lateral high-voltage devices using variation of lateral thickness technique</title><author>Yao, Jiafei ; Guo, Yufeng ; Li, Man ; Huang, Xiaofeng ; Lin, Hong ; Ji, Xincun ; Xu, Yue</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c406t-80c71cf83ca43d418db8e5a8fa97c360f1bcd8273cebd1cbb3fee1fea1dbb8423</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Breakdown</topic><topic>Devices</topic><topic>Electric fields</topic><topic>Electric potential</topic><topic>Mathematical analysis</topic><topic>Mathematical models</topic><topic>Poisson equation</topic><topic>Two dimensional</topic><topic>Voltage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yao, Jiafei</creatorcontrib><creatorcontrib>Guo, Yufeng</creatorcontrib><creatorcontrib>Li, Man</creatorcontrib><creatorcontrib>Huang, Xiaofeng</creatorcontrib><creatorcontrib>Lin, Hong</creatorcontrib><creatorcontrib>Ji, Xincun</creatorcontrib><creatorcontrib>Xu, Yue</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Japanese Journal of Applied Physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yao, Jiafei</au><au>Guo, Yufeng</au><au>Li, Man</au><au>Huang, Xiaofeng</au><au>Lin, Hong</au><au>Ji, Xincun</au><au>Xu, Yue</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Analytical model for silicon-on-insulator lateral high-voltage devices using variation of lateral thickness technique</atitle><jtitle>Japanese Journal of Applied Physics</jtitle><addtitle>Jpn. J. Appl. Phys</addtitle><date>2015-02-01</date><risdate>2015</risdate><volume>54</volume><issue>2</issue><spage>24301</spage><epage>1-024301-6</epage><pages>24301-1-024301-6</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPB6</coden><abstract>Recently, the variation of lateral thickness (VLT) technique has been proposed as an effective lateral voltage-sustaining technology. However, no analytical model has been reported for exploring the physical mechanism quantitatively. By solving the two-dimensional (2D) Poisson equation, an analytical model for a silicon-on-insulator (SOI) device with a VLT structure is proposed in this paper to optimize the surface potential and electric field distribution of the VLT SOI device. The lateral and vertical breakdown voltages are formulized to quantify the breakdown characteristic. The drift doping concentration range is derived to maximize the breakdown voltage. This model is used to investigate the electric field distribution and breakdown voltage of the VLT SOI device with various parameters. The validity of the proposed model is verified by the fair agreement between the analytical and numerical results.</abstract><pub>The Japan Society of Applied Physics</pub><doi>10.7567/JJAP.54.024301</doi><tpages>6</tpages></addata></record> |
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subjects | Breakdown Devices Electric fields Electric potential Mathematical analysis Mathematical models Poisson equation Two dimensional Voltage |
title | Analytical model for silicon-on-insulator lateral high-voltage devices using variation of lateral thickness technique |
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