AFM and Ellipsometry Studies of Ultra Thin Ti Film Deposited on a Silicon Wafer

An ultra- thin Ti film with a thickness of less than 30 nm was deposited on the surface of a silicon wafer by the filtered arc deposition system. A novel technique was adopted to create a height step between the coated area and non-coated area (silicon wafer) during deposition. The surface morpholog...

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Veröffentlicht in:	Materials science forum 2014-01, Vol.773-774, p.616-625
Hauptverfasser:	Zhu, Hong Tao, Lin, Bing Jing, Tieu, A. Kiet, Triani, Gerry
Format:	Artikel
Sprache:	eng
Schlagworte:	Atomic force microscopy Deposition Ellipsometry Silicon Thin films Titanium Titanium dioxide Wafers
Online-Zugang:	Volltext
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