Molecular Dynamics Simulation of Microcrack Healing in Copper Nano-Plate
The molecular dynamics method is used to simulate microcrack healing in copper nano-plate during heating. During microcrack healing, the tip of microcrack is blunted and deforms to round shape, the microcrack becomes smaller and smaller until it is healed through slip bands emitting from the pre-cra...
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| Veröffentlicht in: | Key engineering materials 2012-12, Vol.531-532, p.454-457 |
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| creator | Du, Guo Jun Xia, Dong Yu Wang, Mei Fen |
| description | The molecular dynamics method is used to simulate microcrack healing in copper nano-plate during heating. During microcrack healing, the tip of microcrack is blunted and deforms to round shape, the microcrack becomes smaller and smaller until it is healed through slip bands emitting from the pre-crack tip and expanding to the top and bottom of the copper nano-plate. The healing time is different in different temperature. The healing processes in different temperature present different slip bands for crack healing. When temperature is below 650K, the healing time decreases dramatically with temperature increase. When temperature is above 650K, the healing time decreases smoothly with temperature increase. The critical temperature of microcrack healing in copper nano-plate without pre-existing dislocations is about 400K. |
| doi_str_mv | 10.4028/www.scientific.net/KEM.531-532.454 |
| format | Article |
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During microcrack healing, the tip of microcrack is blunted and deforms to round shape, the microcrack becomes smaller and smaller until it is healed through slip bands emitting from the pre-crack tip and expanding to the top and bottom of the copper nano-plate. The healing time is different in different temperature. The healing processes in different temperature present different slip bands for crack healing. When temperature is below 650K, the healing time decreases dramatically with temperature increase. When temperature is above 650K, the healing time decreases smoothly with temperature increase. The critical temperature of microcrack healing in copper nano-plate without pre-existing dislocations is about 400K.</description><identifier>ISSN: 1013-9826</identifier><identifier>ISSN: 1662-9795</identifier><identifier>EISSN: 1662-9795</identifier><identifier>DOI: 10.4028/www.scientific.net/KEM.531-532.454</identifier><language>eng</language><publisher>Trans Tech Publications Ltd</publisher><subject>COMPUTER SIMULATION ; Copper ; CRACKS ; DISLOCATIONS ; Healing ; Microcracks ; MICROSTRUCTURES ; Molecular dynamics ; Nanostructure ; PLATE ; Simulation ; Slip bands ; SLIP PLANES</subject><ispartof>Key engineering materials, 2012-12, Vol.531-532, p.454-457</ispartof><rights>2013 Trans Tech Publications Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c271t-565e04fbb878e6c8882ce9c3830cc997d70d6f292a6054fdf4ec58344feda23e3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/2064?width=600</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Du, Guo Jun</creatorcontrib><creatorcontrib>Xia, Dong Yu</creatorcontrib><creatorcontrib>Wang, Mei Fen</creatorcontrib><title>Molecular Dynamics Simulation of Microcrack Healing in Copper Nano-Plate</title><title>Key engineering materials</title><description>The molecular dynamics method is used to simulate microcrack healing in copper nano-plate during heating. 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The critical temperature of microcrack healing in copper nano-plate without pre-existing dislocations is about 400K.</description><subject>COMPUTER SIMULATION</subject><subject>Copper</subject><subject>CRACKS</subject><subject>DISLOCATIONS</subject><subject>Healing</subject><subject>Microcracks</subject><subject>MICROSTRUCTURES</subject><subject>Molecular dynamics</subject><subject>Nanostructure</subject><subject>PLATE</subject><subject>Simulation</subject><subject>Slip bands</subject><subject>SLIP PLANES</subject><issn>1013-9826</issn><issn>1662-9795</issn><issn>1662-9795</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNqVkMtKAzEUQAdRsD7-YZYizJj3ZJbaVitaFdR1SNMbTZ0mNZlS-vdGKrjVRbjhcjhwT1GcY1QzROTFZrOpk3Hge2edqT30F3fjac0prjglNeNsrxhgIUjVNi3fz3-EadVKIg6Lo5QWCFEsMR8Uk2nowKw7HcvR1uulM6l8dsu86F3wZbDl1JkYTNTmo5yA7px_K50vh2G1glg-aB-qpwzDSXFgdZfg9GceF6_X45fhpLp_vLkdXt5XhjS4r7jggJidzWQjQRgpJTHQGiopMqZtm3mD5sKSlmiBOLNzy8BwSRmzMNeEAj0uznbeVQyfa0i9WrpkoOu0h7BOCotGIsSkoH9ACUKioYxn9GqH5ltTimDVKrqljluFkfournJx9Vtc5eIqF1e5eH5E5eJZMtpJ-qh96sG8q0VYR59z_EfzBWaMk5g</recordid><startdate>20121201</startdate><enddate>20121201</enddate><creator>Du, Guo Jun</creator><creator>Xia, Dong Yu</creator><creator>Wang, Mei Fen</creator><general>Trans Tech Publications Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>20121201</creationdate><title>Molecular Dynamics Simulation of Microcrack Healing in Copper Nano-Plate</title><author>Du, Guo Jun ; Xia, Dong Yu ; Wang, Mei Fen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c271t-565e04fbb878e6c8882ce9c3830cc997d70d6f292a6054fdf4ec58344feda23e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>COMPUTER SIMULATION</topic><topic>Copper</topic><topic>CRACKS</topic><topic>DISLOCATIONS</topic><topic>Healing</topic><topic>Microcracks</topic><topic>MICROSTRUCTURES</topic><topic>Molecular dynamics</topic><topic>Nanostructure</topic><topic>PLATE</topic><topic>Simulation</topic><topic>Slip bands</topic><topic>SLIP PLANES</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Du, Guo Jun</creatorcontrib><creatorcontrib>Xia, Dong Yu</creatorcontrib><creatorcontrib>Wang, Mei Fen</creatorcontrib><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>Key engineering materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Du, Guo Jun</au><au>Xia, Dong Yu</au><au>Wang, Mei Fen</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Molecular Dynamics Simulation of Microcrack Healing in Copper Nano-Plate</atitle><jtitle>Key engineering materials</jtitle><date>2012-12-01</date><risdate>2012</risdate><volume>531-532</volume><spage>454</spage><epage>457</epage><pages>454-457</pages><issn>1013-9826</issn><issn>1662-9795</issn><eissn>1662-9795</eissn><abstract>The molecular dynamics method is used to simulate microcrack healing in copper nano-plate during heating. During microcrack healing, the tip of microcrack is blunted and deforms to round shape, the microcrack becomes smaller and smaller until it is healed through slip bands emitting from the pre-crack tip and expanding to the top and bottom of the copper nano-plate. The healing time is different in different temperature. The healing processes in different temperature present different slip bands for crack healing. When temperature is below 650K, the healing time decreases dramatically with temperature increase. When temperature is above 650K, the healing time decreases smoothly with temperature increase. The critical temperature of microcrack healing in copper nano-plate without pre-existing dislocations is about 400K.</abstract><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/KEM.531-532.454</doi><tpages>4</tpages></addata></record> |
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| subjects | COMPUTER SIMULATION Copper CRACKS DISLOCATIONS Healing Microcracks MICROSTRUCTURES Molecular dynamics Nanostructure PLATE Simulation Slip bands SLIP PLANES |
| title | Molecular Dynamics Simulation of Microcrack Healing in Copper Nano-Plate |
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