Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

•Highly faceted Cu6Sn5 IMC are observed during solid-state interfacial reactions.•The “time-to-impingement” of intermetallics is established for the first time under solid-state reactions.•The addition of Ag slows down the growth kinetics of intermetallics. The solid-state reactions under confined s...

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