Improvement of bonding strength of a (Pb,Sn)Te–Cu contact manufactured in a low temperature SLID-bonding process

•SLID bonding at low temperature has been employed for the (Pb, Sn)Te thermoelectric modules.•The TE/Ni interface strength was improved up to 10.9 - 13.2 MPa by a pre-coated Sn film.•The modified SLID bonding process will not degrade the module’s thermoelectric properties. A (Pb,Sn)Te thermoelectric...

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Veröffentlicht in:	Journal of alloys and compounds 2014-11, Vol.613, p.46-54
Hauptverfasser:	Chuang, Tung-Han, Yeh, Wei-Ting, Chuang, Chien-Hsun, Hwang, Jenn-Dong
Format:	Artikel
Sprache:	eng
Schlagworte:	(Pb, Sn)Te Adhesive bonding Barrier layers Bonding strength Cross-disciplinary physics: materials science rheology Exact sciences and technology Intermetallic compounds Intermetallics Materials science Materials synthesis materials processing Modules Nickel Physics Silver Solid–liquid interdiffusion bonding Thermoelectricity
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