Finite Element Analysis and Design of Thermal-Mechanical Stresses in Multilayer Ceramic Capacitors

A three‐dimensional finite element model describing the thermal–mechanical stress distribution in multilayer ceramic capacitors (MLCCs) during termination firing, soldering, and bending tests is presented. Numerical results indicate that the thermal residual stresses originating from the soldering p...

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Veröffentlicht in:	International journal of applied ceramic technology 2015-03, Vol.12 (2), p.451-460
Hauptverfasser:	Huang, Chang-Wei, Chen, Ben-Ting, Chen, Kun-Yen, Hsueh, Chun-Hway, Wei, Wen-Cheng, Lee, Chen-Te
Format:	Artikel
Sprache:	eng
Schlagworte:	Boards Capacitors Ceramics Finite element analysis Mathematical analysis Mathematical models Microstructure Multilayers Nickel Solders Tensile stress
Online-Zugang:	Volltext
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