Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues

•Wafer-level hermetic MEMS packaging technology by anodic bonding is reviewed.•The review covers from the early works to the latest ones.•Key points for practical implementation are highlighted.•A new MEMS packaging material, anodically-bondable LTCC wafer, is introduced. This paper reviews wafer-le...

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Veröffentlicht in:	Microelectronics and reliability 2014-05, Vol.54 (5), p.875-881
1. Verfasser:	Tanaka, Shuji
Format:	Artikel
Sprache:	eng
Schlagworte:	Anodic Applied sciences Bonding Ceramics Circuit boards Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Hermetic sealing Integrated circuits Interconnections Materials Micro- and nanoelectromechanical devices (mems/nems) Packaging Printed circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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