Effect of Transverse Grain Boundary on Microstructure, Texture and Mechanical Properties of Drawn Copper Wires
In the present study, microstructure and texture of drawn copper wires with a large number of transverse grain boundaries have been characterized and their mechanical properties have been analyzed. The results show that the texture evolution is accelerated by transverse grain boundary and the satura...
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Veröffentlicht in: | Journal of materials science & technology 2014-02, Vol.30 (2), p.184-191 |
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description | In the present study, microstructure and texture of drawn copper wires with a large number of transverse grain boundaries have been characterized and their mechanical properties have been analyzed. The results show that the texture evolution is accelerated by transverse grain boundary and the saturation value 60% of volume fraction of 〈111〉 fiber texture component is reached rapidly with increasing strain. For the microstructure of drawn wires with a large number of transverse grain boundaries, the critical strain, where lamellar boundaries form, is less than that for wires with equiaxed grains or columnar grains (all grain boundaries parallel to axis direction). Since transverse grain boundary accelerates grain subdivision and dislocation density increases rapidly in drawn wires with a large number of transverse grain boundaries, there are a higher flow stress and a higher work hardening rate. |
doi_str_mv | 10.1016/j.jmst.2013.04.018 |
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The results show that the texture evolution is accelerated by transverse grain boundary and the saturation value 60% of volume fraction of 〈111〉 fiber texture component is reached rapidly with increasing strain. For the microstructure of drawn wires with a large number of transverse grain boundaries, the critical strain, where lamellar boundaries form, is less than that for wires with equiaxed grains or columnar grains (all grain boundaries parallel to axis direction). Since transverse grain boundary accelerates grain subdivision and dislocation density increases rapidly in drawn wires with a large number of transverse grain boundaries, there are a higher flow stress and a higher work hardening rate.</description><identifier>ISSN: 1005-0302</identifier><identifier>EISSN: 1941-1162</identifier><identifier>DOI: 10.1016/j.jmst.2013.04.018</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>BOUNDARIES ; Cold drawing ; Copper ; DISLOCATIONS ; Grain boundaries ; Grains ; MECHANICAL PROPERTIES ; Microstructure ; MICROSTRUCTURES ; PROPERTIES ; Surface layer ; Texture ; TEXTURES ; Transverse grain boundary ; Ultimate tensile strength ; WIRE ; 临界应变 ; 力学性能 ; 加工硬化率 ; 显微组织 ; 晶界 ; 柱状晶粒 ; 织构 ; 铜导线</subject><ispartof>Journal of materials science & technology, 2014-02, Vol.30 (2), p.184-191</ispartof><rights>2013</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c355t-dbfea5e8a24c4fe9f76ffcc71b16f81f3dfb4260c91ce09f2eeae48be84a558c3</citedby><cites>FETCH-LOGICAL-c355t-dbfea5e8a24c4fe9f76ffcc71b16f81f3dfb4260c91ce09f2eeae48be84a558c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://image.cqvip.com/vip1000/qk/84252X/84252X.jpg</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.jmst.2013.04.018$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3536,27903,27904,45974</link.rule.ids></links><search><creatorcontrib>Chen, Jian</creatorcontrib><creatorcontrib>Ma, Xiaoguang</creatorcontrib><creatorcontrib>Yan, Wen</creatorcontrib><creatorcontrib>Xia, Feng</creatorcontrib><creatorcontrib>Fan, Xinhui</creatorcontrib><title>Effect of Transverse Grain Boundary on Microstructure, Texture and Mechanical Properties of Drawn Copper Wires</title><title>Journal of materials science & technology</title><addtitle>Journal of Materials Science & Technology</addtitle><description>In the present study, microstructure and texture of drawn copper wires with a large number of transverse grain boundaries have been characterized and their mechanical properties have been analyzed. The results show that the texture evolution is accelerated by transverse grain boundary and the saturation value 60% of volume fraction of 〈111〉 fiber texture component is reached rapidly with increasing strain. For the microstructure of drawn wires with a large number of transverse grain boundaries, the critical strain, where lamellar boundaries form, is less than that for wires with equiaxed grains or columnar grains (all grain boundaries parallel to axis direction). Since transverse grain boundary accelerates grain subdivision and dislocation density increases rapidly in drawn wires with a large number of transverse grain boundaries, there are a higher flow stress and a higher work hardening rate.</description><subject>BOUNDARIES</subject><subject>Cold drawing</subject><subject>Copper</subject><subject>DISLOCATIONS</subject><subject>Grain boundaries</subject><subject>Grains</subject><subject>MECHANICAL PROPERTIES</subject><subject>Microstructure</subject><subject>MICROSTRUCTURES</subject><subject>PROPERTIES</subject><subject>Surface layer</subject><subject>Texture</subject><subject>TEXTURES</subject><subject>Transverse grain boundary</subject><subject>Ultimate tensile strength</subject><subject>WIRE</subject><subject>临界应变</subject><subject>力学性能</subject><subject>加工硬化率</subject><subject>显微组织</subject><subject>晶界</subject><subject>柱状晶粒</subject><subject>织构</subject><subject>铜导线</subject><issn>1005-0302</issn><issn>1941-1162</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNp9UMtOwzAQjBBIlMcPcDI3DiR4EydxJS5QSkEqgkMRR8t11uCqtYudFPh7HLXiyGlHq5nZnUmSM6AZUKiuFtliFdosp1BklGUU-F4ygCGDFKDK9yOmtExpQfPD5CiEBaVFXXI-SOxYa1QtcZrMvLRhgz4gmXhpLLl1nW2k_yHOkiejvAut71TbebwkM_zuAZG2IU-oPqQ1Si7Ji3dr9K3B0Dveefllycit4468GY_hJDnQchnwdDePk9f78Wz0kE6fJ4-jm2mqirJs02auUZbIZc4U0zjUdaW1UjXModIcdNHoOcsrqoagkA51jiiR8TlyJsuSq-I4udj6rr377DC0YmWCwuVSWnRdEFDVUPKaFhCp-ZbaBwwetVh7s4qxBVDRlysWoi9X9OUKykQsN4qutyKMITYGvQjKoFXYxJSqFY0z_8vPdzc_nH3_NPb97yjj8S3IofgFPqKQ_w</recordid><startdate>20140201</startdate><enddate>20140201</enddate><creator>Chen, Jian</creator><creator>Ma, Xiaoguang</creator><creator>Yan, Wen</creator><creator>Xia, Feng</creator><creator>Fan, Xinhui</creator><general>Elsevier Ltd</general><scope>2RA</scope><scope>92L</scope><scope>CQIGP</scope><scope>W92</scope><scope>~WA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>20140201</creationdate><title>Effect of Transverse Grain Boundary on Microstructure, Texture and Mechanical Properties of Drawn Copper Wires</title><author>Chen, Jian ; Ma, Xiaoguang ; Yan, Wen ; Xia, Feng ; Fan, Xinhui</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c355t-dbfea5e8a24c4fe9f76ffcc71b16f81f3dfb4260c91ce09f2eeae48be84a558c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BOUNDARIES</topic><topic>Cold drawing</topic><topic>Copper</topic><topic>DISLOCATIONS</topic><topic>Grain boundaries</topic><topic>Grains</topic><topic>MECHANICAL PROPERTIES</topic><topic>Microstructure</topic><topic>MICROSTRUCTURES</topic><topic>PROPERTIES</topic><topic>Surface layer</topic><topic>Texture</topic><topic>TEXTURES</topic><topic>Transverse grain boundary</topic><topic>Ultimate tensile strength</topic><topic>WIRE</topic><topic>临界应变</topic><topic>力学性能</topic><topic>加工硬化率</topic><topic>显微组织</topic><topic>晶界</topic><topic>柱状晶粒</topic><topic>织构</topic><topic>铜导线</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Jian</creatorcontrib><creatorcontrib>Ma, Xiaoguang</creatorcontrib><creatorcontrib>Yan, Wen</creatorcontrib><creatorcontrib>Xia, Feng</creatorcontrib><creatorcontrib>Fan, Xinhui</creatorcontrib><collection>中文科技期刊数据库</collection><collection>中文科技期刊数据库-CALIS站点</collection><collection>中文科技期刊数据库-7.0平台</collection><collection>中文科技期刊数据库-工程技术</collection><collection>中文科技期刊数据库- 镜像站点</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>Journal of materials science & technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chen, Jian</au><au>Ma, Xiaoguang</au><au>Yan, Wen</au><au>Xia, Feng</au><au>Fan, Xinhui</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of Transverse Grain Boundary on Microstructure, Texture and Mechanical Properties of Drawn Copper Wires</atitle><jtitle>Journal of materials science & technology</jtitle><addtitle>Journal of Materials Science & Technology</addtitle><date>2014-02-01</date><risdate>2014</risdate><volume>30</volume><issue>2</issue><spage>184</spage><epage>191</epage><pages>184-191</pages><issn>1005-0302</issn><eissn>1941-1162</eissn><abstract>In the present study, microstructure and texture of drawn copper wires with a large number of transverse grain boundaries have been characterized and their mechanical properties have been analyzed. The results show that the texture evolution is accelerated by transverse grain boundary and the saturation value 60% of volume fraction of 〈111〉 fiber texture component is reached rapidly with increasing strain. For the microstructure of drawn wires with a large number of transverse grain boundaries, the critical strain, where lamellar boundaries form, is less than that for wires with equiaxed grains or columnar grains (all grain boundaries parallel to axis direction). Since transverse grain boundary accelerates grain subdivision and dislocation density increases rapidly in drawn wires with a large number of transverse grain boundaries, there are a higher flow stress and a higher work hardening rate.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/j.jmst.2013.04.018</doi><tpages>8</tpages></addata></record> |
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subjects | BOUNDARIES Cold drawing Copper DISLOCATIONS Grain boundaries Grains MECHANICAL PROPERTIES Microstructure MICROSTRUCTURES PROPERTIES Surface layer Texture TEXTURES Transverse grain boundary Ultimate tensile strength WIRE 临界应变 力学性能 加工硬化率 显微组织 晶界 柱状晶粒 织构 铜导线 |
title | Effect of Transverse Grain Boundary on Microstructure, Texture and Mechanical Properties of Drawn Copper Wires |
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