Silicon-on-insulator MOSFETs models in analog/RF domain
SUMMARY Several physical phenomena specific to silicon‐on‐insulator metal–oxide–semiconductor field‐effect transistors, such as floating body effects, self‐heating, and substrate coupling, are described and modeled. Small‐signal equivalent circuit of ultra‐thin body and thin buried oxide and fin fie...
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Veröffentlicht in: | International journal of numerical modelling 2014-09, Vol.27 (5-6), p.707-735 |
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container_title | International journal of numerical modelling |
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creator | Raskin, Jean-Pierre |
description | SUMMARY
Several physical phenomena specific to silicon‐on‐insulator metal–oxide–semiconductor field‐effect transistors, such as floating body effects, self‐heating, and substrate coupling, are described and modeled. Small‐signal equivalent circuit of ultra‐thin body and thin buried oxide and fin field effect transistor (FinFET) are extracted, and their radio frequency figures of merit as well as their advantages and limitations are presented. We demonstrate the importance of performing wideband characterization at the early stage of the technology development in order to identify the device weaknesses and come up with technological solutions to overcome those. With the ongoing downscaling of the metal–oxide–semiconductor devices, the surrounding of the transistor, that is, the contacts, the access lines, and the substrate, starts to play a major role on the transistor behavior. There is an urgent need to develop adequate models for the new generation of devices valid over a wide frequency band. © (2013) The Authors. INTERNATIONAL JOURNAL OF NUMERICAL MODELLING: ELECTRONIC NETWORKS, DEVICES AND FIELDS Published by John Wiley & Sons, Ltd. |
doi_str_mv | 10.1002/jnm.1950 |
format | Article |
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Several physical phenomena specific to silicon‐on‐insulator metal–oxide–semiconductor field‐effect transistors, such as floating body effects, self‐heating, and substrate coupling, are described and modeled. Small‐signal equivalent circuit of ultra‐thin body and thin buried oxide and fin field effect transistor (FinFET) are extracted, and their radio frequency figures of merit as well as their advantages and limitations are presented. We demonstrate the importance of performing wideband characterization at the early stage of the technology development in order to identify the device weaknesses and come up with technological solutions to overcome those. With the ongoing downscaling of the metal–oxide–semiconductor devices, the surrounding of the transistor, that is, the contacts, the access lines, and the substrate, starts to play a major role on the transistor behavior. There is an urgent need to develop adequate models for the new generation of devices valid over a wide frequency band. © (2013) The Authors. INTERNATIONAL JOURNAL OF NUMERICAL MODELLING: ELECTRONIC NETWORKS, DEVICES AND FIELDS Published by John Wiley & Sons, Ltd.</description><identifier>ISSN: 0894-3370</identifier><identifier>EISSN: 1099-1204</identifier><identifier>DOI: 10.1002/jnm.1950</identifier><language>eng</language><publisher>Bognor Regis: Blackwell Publishing Ltd</publisher><subject>Devices ; Field effect transistors ; FinFET ; high frequency ; Mathematical models ; Modelling ; MOSFETs ; Networks ; Semiconductor devices ; SOI MOSFET ; Transistors ; UTBB ; wideband characterization</subject><ispartof>International journal of numerical modelling, 2014-09, Vol.27 (5-6), p.707-735</ispartof><rights>(2013) The Authors. International Journal of Numerical Modelling: Electronic Networks, Devices and Fields Published by John Wiley & Sons, Ltd.</rights><rights>Copyright © 2014 John Wiley & Sons, Ltd.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3970-21ed9ab04289ce5680eb2fb06f4ce2617c97793e0115ab25670c5f75779fcff23</citedby><cites>FETCH-LOGICAL-c3970-21ed9ab04289ce5680eb2fb06f4ce2617c97793e0115ab25670c5f75779fcff23</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fjnm.1950$$EPDF$$P50$$Gwiley$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fjnm.1950$$EHTML$$P50$$Gwiley$$Hfree_for_read</linktohtml><link.rule.ids>314,776,780,1411,27901,27902,45550,45551</link.rule.ids></links><search><creatorcontrib>Raskin, Jean-Pierre</creatorcontrib><title>Silicon-on-insulator MOSFETs models in analog/RF domain</title><title>International journal of numerical modelling</title><addtitle>Int. J. Numer. Model</addtitle><description>SUMMARY
Several physical phenomena specific to silicon‐on‐insulator metal–oxide–semiconductor field‐effect transistors, such as floating body effects, self‐heating, and substrate coupling, are described and modeled. Small‐signal equivalent circuit of ultra‐thin body and thin buried oxide and fin field effect transistor (FinFET) are extracted, and their radio frequency figures of merit as well as their advantages and limitations are presented. We demonstrate the importance of performing wideband characterization at the early stage of the technology development in order to identify the device weaknesses and come up with technological solutions to overcome those. With the ongoing downscaling of the metal–oxide–semiconductor devices, the surrounding of the transistor, that is, the contacts, the access lines, and the substrate, starts to play a major role on the transistor behavior. There is an urgent need to develop adequate models for the new generation of devices valid over a wide frequency band. © (2013) The Authors. INTERNATIONAL JOURNAL OF NUMERICAL MODELLING: ELECTRONIC NETWORKS, DEVICES AND FIELDS Published by John Wiley & Sons, Ltd.</description><subject>Devices</subject><subject>Field effect transistors</subject><subject>FinFET</subject><subject>high frequency</subject><subject>Mathematical models</subject><subject>Modelling</subject><subject>MOSFETs</subject><subject>Networks</subject><subject>Semiconductor devices</subject><subject>SOI MOSFET</subject><subject>Transistors</subject><subject>UTBB</subject><subject>wideband characterization</subject><issn>0894-3370</issn><issn>1099-1204</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><sourceid>24P</sourceid><recordid>eNp10FFLwzAQB_AgCs4p-BEKvvjS7ZI0TfMom53KNsVNfAxZlkpm28xmRfftzZgoCkLgIPzuuPsjdI6hhwFIf1VXPSwYHKAOBiFiTCA5RB3IRBJTyuEYnXi_AgCKGekgPrOl1a6Ow7O1b0u1cU00uZ_l13MfVW5pSh_ZOlK1Kt1L_zGPlq5Stj5FR4UqvTn7ql30FDoGN_H4fnQ7uBrHmgoOMcFmKdQCEpIJbViagVmQYgFpkWhDUsy14FxQAxgztSAs5aBZwVn4LHRRENpFl_u568a9tcZvZGW9NmWpauNaL3HKMcvCpWmgF3_oyrVN2DsoxpKEEp4lPwN147xvTCHXja1Us5UY5C5BGRKUuwQDjff03ZZm-6-Td9PJb2_9xnx8e9W8ypRTzuTzdCSH84d8OhlimdNPwVJ-Dw</recordid><startdate>201409</startdate><enddate>201409</enddate><creator>Raskin, Jean-Pierre</creator><general>Blackwell Publishing Ltd</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>24P</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>JQ2</scope><scope>KR7</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>7SP</scope></search><sort><creationdate>201409</creationdate><title>Silicon-on-insulator MOSFETs models in analog/RF domain</title><author>Raskin, Jean-Pierre</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3970-21ed9ab04289ce5680eb2fb06f4ce2617c97793e0115ab25670c5f75779fcff23</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Devices</topic><topic>Field effect transistors</topic><topic>FinFET</topic><topic>high frequency</topic><topic>Mathematical models</topic><topic>Modelling</topic><topic>MOSFETs</topic><topic>Networks</topic><topic>Semiconductor devices</topic><topic>SOI MOSFET</topic><topic>Transistors</topic><topic>UTBB</topic><topic>wideband characterization</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Raskin, Jean-Pierre</creatorcontrib><collection>Istex</collection><collection>Wiley Online Library Open Access</collection><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Electronics & Communications Abstracts</collection><jtitle>International journal of numerical modelling</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Raskin, Jean-Pierre</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Silicon-on-insulator MOSFETs models in analog/RF domain</atitle><jtitle>International journal of numerical modelling</jtitle><addtitle>Int. J. Numer. Model</addtitle><date>2014-09</date><risdate>2014</risdate><volume>27</volume><issue>5-6</issue><spage>707</spage><epage>735</epage><pages>707-735</pages><issn>0894-3370</issn><eissn>1099-1204</eissn><abstract>SUMMARY
Several physical phenomena specific to silicon‐on‐insulator metal–oxide–semiconductor field‐effect transistors, such as floating body effects, self‐heating, and substrate coupling, are described and modeled. Small‐signal equivalent circuit of ultra‐thin body and thin buried oxide and fin field effect transistor (FinFET) are extracted, and their radio frequency figures of merit as well as their advantages and limitations are presented. We demonstrate the importance of performing wideband characterization at the early stage of the technology development in order to identify the device weaknesses and come up with technological solutions to overcome those. With the ongoing downscaling of the metal–oxide–semiconductor devices, the surrounding of the transistor, that is, the contacts, the access lines, and the substrate, starts to play a major role on the transistor behavior. There is an urgent need to develop adequate models for the new generation of devices valid over a wide frequency band. © (2013) The Authors. INTERNATIONAL JOURNAL OF NUMERICAL MODELLING: ELECTRONIC NETWORKS, DEVICES AND FIELDS Published by John Wiley & Sons, Ltd.</abstract><cop>Bognor Regis</cop><pub>Blackwell Publishing Ltd</pub><doi>10.1002/jnm.1950</doi><tpages>29</tpages><oa>free_for_read</oa></addata></record> |
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subjects | Devices Field effect transistors FinFET high frequency Mathematical models Modelling MOSFETs Networks Semiconductor devices SOI MOSFET Transistors UTBB wideband characterization |
title | Silicon-on-insulator MOSFETs models in analog/RF domain |
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